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April 20, 2005 Document No. 38-12025 Rev. *G 32
CY8C21x34 Final Data Sheet 4. Packaging Information
Figure 4-4. 32-Lead (5x5 mm) MLF
Important Note For information on the preferred dimensions for mounting MLF packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
4.2 Thermal Impedances
Table 4-1. Thermal Impedances per Package
Package Typical θ
JA
* Typical θ
JC
16 SOIC
123
o
C/W 55
o
C/W
20 SSOP
117
o
C/W 41
o
C/W
28 SSOP
96
o
C/W 39
o
C/W
32 MLF
22
o
C/W 12
o
C/W
* T
J
= T
A
+ Power x θ
JA
51-85188 **
E-PAD X, Y for this product is 3.71 mm, 3.71 mm (+/-0.08 mm)