Datasheet

CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Document Number: 38-12025 Rev. AB Page 37 of 53
Thermal Impedances
Solder Reflow Specifications
Tab le 30 shows the solder reflow temperature limits that must not be exceeded.
Table 29. Thermal Impedances per Package
Package Typical 
JA
[37]
Typical 
JC
16-pin SOIC 123 °C/W 55 °C/W
20-pin SSOP 117 °C/W 41 °C/W
28-pin SSOP 96 °C/W 39 °C/W
32-pin QFN
[38]
5 × 5 mm 0.60 Max 27 °C/W 15 °C/W
32-pin QFN
[38]
5 × 5 mm 1.00 Max 22 °C/W 12 °C/W
56-pin SSOP 48 °C/W 24 °C/W
Table 30. Solder Reflow Specifications
Package Maximum Peak Temperature (T
C
) Maximum Time above T
C
– 5 °C
16-pin SOIC 260 °C 30 seconds
20-pin SSOP 260 °C 30 seconds
28-pin SSOP 260 °C 30 seconds
32-pin QFN 260 °C 30 seconds
56-pin SSOP 260 °C 30 seconds
Notes
37. T
J
= T
A
+ Power × 
JA
38. To achieve the thermal impedance specified for the QFN package, refer to Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF)
Packages
available at http://www.amkor.com.
39. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
C with Sn-Pb or 245 ± 5 C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.