Datasheet

CY8C21634, CY8C21534, CY8C21434
CY8C21334, CY8C21234
Document Number: 38-12025 Rev. AB Page 33 of 53
Packaging Information
This section shows the packaging specifications for the CY8C21x34 PSoC device with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com.
Figure 15. 16-pin SOIC (150 Mils) Package Outline, 51-85068
51-85068 *E