User guide

CY7C68013A, CY7C68014A
CY7C68015A, CY7C68016A
Document Number: 38-08032 Rev. *X Page 39 of 71
5. Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ................................ –65 C to +150 C
Ambient temperature with
power supplied (commercial).......................... 0 °C to +70 °C
Ambient temperature with
power supplied (industrial)....................... –40 C to + 105 C
Supply voltage to ground potential ...............–0.5 V to +4.0 V
DC input voltage to any input pin
[17]
............................5.25 V
DC voltage applied to outputs
in high Z state..................................... –0.5 V to V
CC
+ 0.5 V
Power dissipation ..................................................... 300 mW
Static discharge voltage............................................>2000 V
Max output current, per I/O port .................................. 10 mA
Max output current, all five I/O ports
(128-pin and 100-pin packages)..................................50 mA
6. Operating Conditions
T
A
(ambient temperature under bias)
Commercial .................................................... 0 °C to +70 °C
T
A
(ambient temperature under bias)
Industrial................................................... –40 °C to +105 °C
Supply voltage..........................................+3.00 V to +3.60 V
Ground voltage.................................................................0 V
F
OSC
(oscillator or crystal frequency) ..... 24 MHz ± 100 ppm,
parallel resonant
7. Thermal Characteristics
The following table displays the thermal characteristics of various packages:
The junction temperature 
j
, can be calculated using the following equation: 
j
= P*
Ja
+ 
a
Where,
P = Power

Ja
= Junction to ambient temperature (
Jc
+ 
Ca
)

a
= Ambient temperature (70 °C)
The case temperature 
c
, can be calculated using the following equation: 
c
= P*
Ca
+ 
a
where,
P = Power

Ca
= Case to ambient temperature

a
= Ambient temperature (70 °C)
Table 12. Thermal Characteristics
Package
Ambient
Temperature (°C)
Jc
Junction to Case
Thermal Resistance (°C/W)
Ja
Junction to Ambient Thermal
Resistance (°C/W)
56 SSOP 70 24.4 47.7
100 TQFP 70 11.9 45.9
128 TQFP 70 15.5 43.2
56 QFN 70 10.6 25.2
56 VFBGA 70 30.9 58.6
Note
17. Do not power I/O with the chip power OFF.