User`s guide

CY7C63722C
CY7C63723C
CY7C63743C
FOR
FOR
Document #: 38-08022 Rev. *C Page 47 of 49
28.0 Package Diagrams (continued)
24-Lead Quarter Size Outline Q13
51-85055-B
DIE FORM
4
5
6
7
8
9
3
24 23
22
21
20
19
18
11 12 13 14
15 16
17
10
2
1
25
(1907, 3001)
(0,0)
Y
X
Die Step: 1907 x 3011 microns
Die Size: 1830.8 x 2909 microns
Die Thickness: 14 mils = 355.6 microns
Pad Size: 80 x 80 microns
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