User`s guide

CY7C63722C
CY7C63723C
CY7C63743C
FOR
FOR
Document #: 38-08022 Rev. *C Page 45 of 49
27.0 Ordering Information
Ordering Code EPROM
Size
Package
Name
Package Type Operating
Range
CY7C63723C-PXC 8 KB P3 18-Pin (300-Mil) Lead-free PDIP Commercial
CY7C63723C-SXC 8 KB S3 18-Pin Small Outline Lead-free Package Commercial
CY7C63743C-PXC 8 KB P13 24-Pin (300-Mil) Lead-free PDIP Commercial
CY7C63743C-SXC 8 KB S13 24-Pin Small Outline Lead-free Package Commercial
CY7C63743C-QXC 8 KB Q13 24-lead QSOP Lead-free Package Commercial
CY7C63722C-XC 8 KB – 25-Pad DIE Form Commercial
28.0 Package Diagrams
51-85010-*A
18-Lead (300-Mil) Molded DIP P3
51-85023-A
PIN 1 ID
SEATING PLANE
0.447[11.353]
0.463[11.760]
18 Lead (300 Mil) SOIC - S3
19
10 18
*
*
*
DIMENSIONS IN INCHES[MM]
MIN.
MAX.
0.291[7.391]
0.300[7.620]
0.394[10.007]
0.419[10.642]
0.050[1.270]
TYP.
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.0118[0.299]
0.0091[0.231]
0.0125[0.317]
0.015[0.381]
0.050[1.270]
0.013[0.330]
0.019[0.482]
0.026[0.660]
0.032[0.812]
0.004[0.101]
REFERENCE JEDEC MO-119
PART #
S18.3 STANDARD PKG.
SZ18.3 LEAD FREE PKG.
18-Lead (300-Mil) Molded SOIC S3
51-85023-*B