Datasheet

CY7C1543V18
CY7C1545V18
Document Number: 001-05389 Rev. *H Page 24 of 26
Ordering Information
The following table contains only the parts that are currently available. If you do not see what you are looking for, contact your local
sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary page at
http://www.cypress.com/products
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices.
Table 1. Ordering Information
Speed
(MHz) Ordering Code
Package
Diagram Package Type
Operating
Range
333 CY7C1543V18-333BZC 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Commercial
CY7C1545V18-333BZC
CY7C1543V18-333BZI 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Industrial
Package Diagram
Figure 6. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85195
A
1
PIN 1 CORNER
17.00±0.10
15.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.08 M C
B
A
0.15(4X)
0.35±0.06
1.40 MAX.
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
C
1.00
5.00
0.36
+0.14
-0.06
SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT : 0.65g
JEDEC REFERENCE : MO-216 / ISSUE E
PACKAGE CODE : BB0AD
51-85195-*B
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