Datasheet

CY7C1543V18
CY7C1545V18
Document Number: 001-05389 Rev. *H Page 21 of 26
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions Max Unit
C
IN
Input Capacitance T
A
= 25C, f = 1 MHz, V
DD
= 1.8V, V
DDQ
= 1.5V 5 pF
C
CLK
Clock Input Capacitance 6 pF
C
O
Output Capacitance 7pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions
165 FBGA
Package
Unit

JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
11.82 °C/W

JC
Thermal Resistance
(Junction to Case)
2.33 °C/W
Figure 4. AC Test Loads and Waveforms
1.25V
0.25V
R = 50
5pF
INCLUDING
JIG AND
SCOPE
ALL INPUT PULSES
Device
R
L
= 50
Z
0
= 50
V
REF
= 0.75V
V
REF
= 0.75V
[23]
0.75V
Under
Tes t
0.75V
Device
Under
Tes t
OUTPUT
0.75V
V
REF
V
REF
OUTPUT
ZQ
ZQ
(a)
Slew Rate = 2 V/ns
RQ =
250

(b)
RQ =
250

Note
23. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250, V
DDQ
= 1.5V, input pulse
levels of 0.25V to 1.25V, and output loading of the specified I
OL
/I
OH
and load capacitance shown in (a) of AC Test Loads and Waveforms.
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