Datasheet

CY7C1518JV18
CY7C1520JV18
Document Number: 001-12559 Rev. *E Page 22 of 23
Ordering Information
The table below contains only the parts that are currently available. If you don’t see what you are looking for, please contact your local
sales representative. For more information, visit the Cypress website at www.cypress.com and refer to the product summary page at
http://www.cypress.com/products
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives and distributors. To find the office
closest to you, visit us at http://www.cypress.com/go/datasheet/offices
Table 1. Ordering Information
Speed
(MHz) Ordering Code
Package
Diagram Package Type
Operating
Range
300 CY7C1518JV18-300BZC 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Commercial
CY7C1520JV18-300BZC
CY7C1518JV18-300BZXC 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free
CY7C1520JV18-300BZXC
250 CY7C1518JV18-250BZC 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Commercial
Package Diagram
Figure 6. 165-Ball FBGA (15 x 17 x 1.40 mm), 51-85195
51-85195-*B
A
1
PIN 1 CORNER
17.00±0.10
15.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25 M C A B
Ø0.08 M C
B
A
0.15(4X)
0.35±0.06
1.40 MAX.
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
C
1.00
5.00
0.36
+0.14
-0.06
SOLDER PAD TYPE : NON SOLDER MASK DEFINED (NSMD)
NOTES :
PACKAGE WEIGHT : 0.65g
JEDEC REFERENCE : MO-216 / ISSUE E
PACKAGE CODE : BB0AD
[+] Feedback