Datasheet

CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
Document Number: 001-00436 Rev. *L Page 24 of 31
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions Max Unit
C
IN
Input Capacitance T
A
= 25C, f = 1 MHz, V
DD
= 1.8V, V
DDQ
= 1.5V 4 pF
C
O
Output Capacitance 4pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter Description Test Conditions
165 FBGA
Package
Unit

JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
13.7 °C/W

JC
Thermal Resistance
(Junction to Case)
3.73 °C/W
Figure 4. AC Test Loads and Waveforms
1.25V
0.25V
R = 50
5pF
INCLUDING
JIG AND
SCOPE
ALL INPUT PULSES
DEVICE
R
L
= 50
Z
0
= 50
V
REF
= 0.75V
V
REF
= 0.75V
[20]
0.75V
UNDER
TEST
0.75V
DEVICE
UNDER
TEST
OUTPUT
0.75V
V
REF
V
REF
OUTPUT
ZQ
ZQ
(a)
SLEW RATE= 2 V/ns
RQ =
250

(b)
RQ =
250

Note
20. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250, V
DDQ
= 1.5V, input
pulse levels of 0.25V to 1.25V, and output loading of the specified I
OL
/I
OH
and load capacitance shown in (a) of AC Test Loads and Waveforms.
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