Specifications

CY14C101PA
CY14B101PA
CY14E101PA
Document Number: 001-54392 Rev. *N Page 33 of 44
Thermal Resistance
Parameter
[13]
Description Test Conditions 16-pin SOIC Unit

JA
Thermal resistance
(junction to ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, per
EIA/JESD51.
56.68 C/W

JC
Thermal resistance
(junction to case)
32.11 C/W
AC Test Loads and Waveforms
Figure 34. AC Test Loads and Waveforms
For 2.5 V (CY14C101PA):
For 3 V (CY14B101PA):
For 5 V (CY14E101PA):
2.5 V
OUTPUT
5 pF
R1
R2
1290 
2.5 V
OUTPUT
30 pF
R1
R2
1290 
909 
909 
For Tri-state specs
3.0 V
OUTPUT
5 pF
R1
R2
789 
3.0 V
OUTPUT
30 pF
R1
R2
789 
577 
577 
For Tri-state specs
5.0 V
OUTPUT
5 pF
R1
R2
512 
5.0 V
OUTPUT
30 pF
R1
R2
512 
963 
963 
For Tri-state specs
AC Test Conditions
Description CY14C101PA CY14B101PA CY14E101PA
Input pulse levels 0 V to 2.5 V 0 V to 3 V 0 V to 3 V
Input rise and fall times (10%–90%) <
3 ns < 3 ns < 3 ns
Input and output timing reference levels 1.25 V 1.5 V 1.5 V
Note
13. These parameters are guaranteed by design and are not tested.