Data Sheet
Table Of Contents
- CYBT-343052-02, EZ-BT WICED Module
- General Description
- Benefits
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Connections and Optional External Components
- Functional Description
- Integrated Radio Transceiver
- Peripheral and Communication Interfaces
- Keyboard Scanner
- Clock Frequencies
- GPIO Port
- PWM
- Power Management Unit
- Electrical Characteristics
- Chipset RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-28053 Rev. ** Page 8 of 47
CYBT-343052-02
Table 3 provides the center location for each solder pad on the CYBT-343052-02. All dimensions are referenced to the center of the
solder pad. Refer to Figure for the location of each module solder pad.
Figure 7. Solder Pad Reference Location
Table 3. Module Solder Pad Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
1
(0.38, 7.72) (14.96, 303.94)
2
(0.38, 8.62) (14.96, 339.37)
3
(0.38, 9.53) (14.96, 375.20)
4
(0.38, 10.43) (14.96, 410.63)
5
(0.38, 11.33) (14.96, 446.06)
6
(0.38, 12.23) (14.96, 481.50)
7
(0.38, 13.13) (14.96, 516.93)
8
(0.38, 14.03) (14.96, 552.36)
9
(0.38, 14.94) (14.96, 588.19)
10
(0.38, 15.84) (14.96, 623.62)
11
(0.38, 16.74) (14.96, 659.05)
12
(0.38, 17.64) (14.96, 694.49)
13
(0.38, 18.54) (14.96, 729.92)
14
(0.38, 19.44) (14.96, 765.35)
15
(0.38, 20.35) (14.96, 801.18)
16
(1.70, 22.02) (66.93, 866.93)
17
(2.60, 22.02) (102.36, 866.93)
18
(3.50, 22.02) (137.80, 866.93)
19
(4.40, 22.02) (173.23, 866.93)
20
(5.30, 22.02) (208.66, 866.93)
21
(6.20, 22.02) (244.09, 866.93)
22
(7.11, 22.02) (279.92, 866.93)
23
(8.01, 22.02) (315.35, 866.93)
24
(8.91, 22.02) (350.79, 866.93)
25 (9.81, 22.02) (386.22, 866.93)
26 (10.71, 22.02) (421.65, 866.93)
27 (11.61, 22.02) (457.09, 866.93)
28 (12.93, 20.35) (509.05, 801.18)
29 (12.93, 19.44) (509.05, 765.35)
30 (12.93, 18.54) (509.05, 729.92)
31 (12.93, 17.64) (509.05, 694.49)
32 (12.93, 16.74) (509.05, 659.05)
33 (12.93, 15.84) (509.05, 623.62)
34 (12.93, 14.94) (509.05, 588.19)
35 (12.93, 14.03) (509.05, 552.36)
36 (12.93, 13.13) (509.05, 516.93)
37 (12.93, 12.23) (509.05, 481.50)
38 (12.93, 11.33) (509.05, 446.06)
39 (12.93, 10.43) (509.05, 410.63)
40 (12.93, 9.53) (509.05, 375.20)
41 (12.93, 8.62) (509.05, 339.37)
42 (12.93, 7.72) (509.05, 303.94)
Table 3. Module Solder Pad Location
Solder Pad
(Center of Pad)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
Top View (Seen on Host PCB)