User's Manual
Table Of Contents
- EZ-BLE™ PRoC™ Bluetooth 4.2 Module
- General Description
- Benefits
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Power Supply Connections and Recommended External Components
- Electrical Specification
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
PRELIMINARY
CYBLE-222014-01
Document Number: 002-11186 Rev. ** Page 32 of 37
Packaging
The CYBLE-222014-01 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-222014-01.
Figure 10. CYBLE-222014-01 Tape Dimensions
Figure 11 details the orientation of the CYBLE-222014-01 in the tape as well as the direction for unreeling.
Figure 11. Component Orientation in Tape and Unreeling Direction
Table 52. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at PeakTemperature No. of Cycles
CYBLE-222014-01 22-pad SMT 260 °C 30 seconds 2
Table 53. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBLE-222014-01 22-pad SMT MSL 3