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EZ-BLE™ PRoC™ Bluetooth 4.2 Module

PRELIMINARY

CYBLE-222014-01

EZ-BLE™ PRoC™ Bluetooth 4.2 Module

Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600

Document Number: 002-11186 Rev. **

Revised February 18, 2016

EZ-BLE™ PRoC™ Bl uetooth 4.2 Mo dule

General Description

The Cypress CYBLE-222014-01 is a fully certified and qualified

module supporting Bluetooth



Low Energy (BLE) 4.2 wireless

communication. The CYBLE-222014-01 is a turnkey solution

and includes onboard crystal oscillators, chip antenna, passive

components, and Cypress PRoC™ BLE. Refer to the

CYBL10X7X datasheet for additional details on the capabilities

of the PRoC BLE device used on this module.

The CYBLE-222014-01 supports a number of peripheral

functions (ADC, timers, counters, PWM) and serial

communication protocols (I

C, UART, SPI) through its

programmable architecture. The CYBLE-222014-01 includes a

royalty-free BLE stack compatible with Bluetooth 4.2 and

provides up to 16 GPIOs in a small 10 × 10 × 1.80 mm package.

The CYBLE-222014-01 is drop-in compatible with the

CYBLE-022001-00 (128KB BT 4.1) and CYBLE-222005-00

(256KB BT 4.1).

Module Description

■ Module size: 10.0 mm ×10.0 mm × 1.80 mm (with shield)

■ 256-KB flash memory, 32-KB SRAM memory

■ Up to 16 GPIOs configurable as open drain high/low,

pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output

■ Bluetooth 4.2 qualified single-mode module

■ Certified to FCC, CE MIC, KC, and IC regulations

■ Eight-channel direct memory access (DMA) controller

■ 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit

multiply, operating at up to 48 MHz

■ Industrial temperature range: –40 °C to +85 °C

■ Watchdog timer with dedicated internal low-speed oscillator

(ILO)

■ Two-pin SWD for programming

Power Consumption

■ TX output power: –18 dbm to +3 dbm

■ Received signal strength indicator (RSSI) with 1-dB resolution

■ TX current consumption of 15.6 mA (radio only, 0 dbm)

■ RX current consumption of 16.4 mA (radio only)

■ Low power mode support

❐ Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on

❐ Hibernate: 150 nA with SRAM retention

❐ Stop: 60 nA with XRES wakeup

Functional Capabilities

■ Up to 15 capacitive sensors for buttons or sliders with

best-in-class signal-to-noise ration (SNR) and liquid tolerance

■ 12-bit, 1-Msps SAR ADC with internal reference,

sample-and-hold (S/H), and channel sequencer

■ Two serial communication blocks (SCBs) supporting I

(master/slave), SPI (master/slave), or UART

■ Four dedicated 16-bit timer, counter, or PWM blocks

(TCPWMs)

■ Programmable low voltage detect (LVD) from 1.8 V to 4.5 V

■ I

S master interface

■ Bluetooth Low Energy protocol stack supporting generic

access profile (GAP) Central, Peripheral, Observer, or

Broadcaster roles

■ Switches between Central and Peripheral roles on-the-go

■ Standard Bluetooth Low Energy profiles and services for

interoperability

■ Custom profile and service for specific use cases

Benefits

The CYBLE-222014-01 module is provided as a turnkey

solution, including all necessary hardware required to use BLE

communication standards.

■ Proven, qualified, and certified hardware design ready to use

■ Small footprint (10 × 10 mm × 1.80 mm), perfect for space

constrained applications

■ Reprogrammable architecture

■ Fully certified module eliminates the time needed for design,

development and certification processes

■ Bluetooth SIG qualified with QDID and Declaration ID

■ Flexible communication protocol support

■ PSoC Creator™ provides an easy-to-use integrated design

environment (IDE) to configure, develop, program, and test a

BLE application

Summary of content (37 pages)

PAGE 1
CYBLE-222014-01 PRELIMINARY EZ-BLE™ PRoC™ Bluetooth 4.2 Module EZ-BLE™ PRoC™ Bluetooth 4.2 Module General Description Functional Capabilities The Cypress CYBLE-222014-01 is a fully certified and qualified module supporting Bluetooth Low Energy (BLE) 4.2 wireless communication. The CYBLE-222014-01 is a turnkey solution and includes onboard crystal oscillators, chip antenna, passive components, and Cypress PRoC™ BLE.
PAGE 2
PRELIMINARY CYBLE-222014-01 More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design. ■ ■ ■ ■ Overview: EZ-BLE Module Portfolio, Module Roadmap EZ-BLE PRoC Product Overview PRoC BLE Silicon Datasheet Application notes: Cypress offers a number of BLE application notes covering a broad range of topics, from basic to advanced level.
PAGE 3
PRELIMINARY CYBLE-222014-01 Contents Overview ............................................................................ 4 Module Description ...................................................... 4 Pad Connection Interface ................................................ 6 Recommended Host PCB Layout ................................... 7 Power Supply Connections and Recommended External Components .................. 10 Connection Options ...................................................
PAGE 4
CYBLE-222014-01 PRELIMINARY Overview Module Description The CYBLE-222014-01 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained.
PAGE 5
PRELIMINARY CYBLE-222014-01 Figure 1. Module Mechanical Drawing Top View (View from Top) Side View Bottom View (Seen from Bottom) Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout” on page 7. Document Number: 002-11186 Rev.
PAGE 6
CYBLE-222014-01 PRELIMINARY Pad Connection Interface As shown in the bottom view of Figure 1 on page 5, the CYBLE-222014-01 connects to the host board via solder pads on the back of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-222014-01 module. Table 2. Solder Pad Connection Description Name SP Connections Connection Type 22 Solder Pads Pad Length Dimension Pad Width Dimension Pad Pitch 0.71 mm 0.41 mm 0.76 mm Figure 2.
PAGE 7
PRELIMINARY CYBLE-222014-01 Recommended Host PCB Layout Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the CYBLE-222014-01. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm (0.455 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 4, Figure 5, or Figure 6.
PAGE 8
PRELIMINARY CYBLE-222014-01 Table 3 provides the center location for each solder pad on the CYBLE-222014-01. All dimensions reference the to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location Solder Pad (Center of Pad) Location (X,Y) from Orign (mm) Dimension from Orign (mils) 1 (0.26, 1.64) (10.24, 64.57) 2 (0.26, 2.41) (10.24, 94.88) 3 (0.26, 3.17) (10.24, 124.80) 4 (0.
PAGE 9
CYBLE-222014-01 PRELIMINARY Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on CYBLE-222014-01, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each connection is configurable for a single option shown with a ✓. Table 4.
PAGE 10
CYBLE-222014-01 PRELIMINARY Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-222014-01 contains two power supply connections, VDD and VDDR. The VDD connection supplies power for both digital and analog device operation. The VDDR connection supplies power for the device radio. In either connection scenario, it is recommended to place an external ferrite bead between the supply and the module connection.
PAGE 11
PRELIMINARY CYBLE-222014-01 The CYBLE-222014-01 schematic is shown in Figure 9. Figure 9. CYBLE-222014-01 Schematic Diagram Document Number: 002-11186 Rev.
PAGE 12
CYBLE-222014-01 PRELIMINARY Critical Components List Table 5 details the critical components used in the CYBLE-222014-01 module. Table 5. Critical Component List Component Reference Designator Silicon U1 Description 76-pin WLCSP Programmable Radio-on-Chip (PRoC) with BLE Crystal Y1 24.000 MHz, 10PF Crystal Y2 32.768 kHz, 12.5PF Antenna E1 2.4 – 2.5 GHz chip antenna Antenna Design Table 6 details the chip antenna used in the CYBLE-222014-01 module.
PAGE 13
CYBLE-222014-01 PRELIMINARY Electrical Specification Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 7. CYBLE-222014-01 Absolute Maximum Ratings Parameter Description Min Typ Max Units Details/Conditions VDDD_ABS Analog, digital, or radio supply relative to VSS (VSSD = VSSA) –0.5 – 6 V Absolute maximum VCCD_ABS Direct digital core voltage input relative to VSSD –0.5 – 1.
PAGE 14
CYBLE-222014-01 PRELIMINARY Table 9. CYBLE-222014-01 DC Specifications (continued) Parameter Description Min Typ Max Units Details/Conditions IDD8 Execute from flash; CPU at 12 MHz – – – mA T = –40 °C to 85 °C IDD9 Execute from flash; CPU at 24 MHz – 7.1 – mA T = 25 °C, VDD = 3.3 V IDD10 Execute from flash; CPU at 24 MHz – – – mA T = –40 °C to 85 °C IDD11 Execute from flash; CPU at 48 MHz – 13.4 – mA T = 25 °C, VDD = 3.
PAGE 15
CYBLE-222014-01 PRELIMINARY Table 10. AC Specifications Min Typ Max Units FCPU Parameter CPU frequency Description 3 – 48 MHz Details/Conditions TSLEEP Wakeup from Sleep mode – 0 – µs Guaranteed by characterization TDEEPSLEEP Wakeup from Deep-Sleep mode – – 25 µs 24-MHz IMO. Guaranteed by characterization THIBERNATE Wakeup from Hibernate mode – – 2 ms Guaranteed by characterization TSTOP Wakeup from Stop mode – – 2.2 ms XRES wakeup 1.71 V VDD 5.
PAGE 16
CYBLE-222014-01 PRELIMINARY Table 12. GPIO AC Specifications Parameter Description Min Typ Max Units Details/Conditions TRISEF Rise time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF TFALLF Fall time in Fast-Strong mode 2 – 12 ns 3.3-V VDDD, CLOAD = 25 pF TRISES Rise time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF TFALLS Fall time in Slow-Strong mode 10 – 60 ns 3.3-V VDDD, CLOAD = 25 pF FGPIOUT1 GPIO Fout; 3.3 V  VDD 5.
PAGE 17
CYBLE-222014-01 PRELIMINARY Table 16. XRES AC Specifications Parameter TRESETWIDTH Description Min Typ Max Units Details/Conditions 1 – – µs – Reset pulse width Temperature Sensor Table 17. Temperature Sensor Specifications Parameter TSENSACC Description Temperature-sensor accuracy Min –5 Typ ±1 Max 5 Units °C Details/Conditions –40 to +85 °C Details/Conditions SAR ADC Table 18.
PAGE 18
CYBLE-222014-01 PRELIMINARY Table 19. SAR ADC AC Specifications (continued) Parameter Description Min Typ Max Units Details/ Conditions A_dnl Differential nonlinearity. VDD = 1.71 V to 5.5 V, 1 Msps –1 – 2.2 LSB VREF = 1 V to VDD A_DNL Differential nonlinearity. VDD = 1.71 V to 3.6 V, 1 Msps –1 – 2 LSB VREF = 1.71 V to VDD A_DNL Differential nonlinearity. VDD = 1.71 V to 5.5 V, 500 Ksps –1 – 2.
PAGE 19
CYBLE-222014-01 PRELIMINARY Digital Peripherals Timer Table 20. Timer DC Specifications Parameter ITIM1 Description Block current consumption at 3 MHz Min – Typ – Max 43 Units µA Details/Conditions 16-bit timer ITIM2 Block current consumption at 12 MHz – – 152 µA 16-bit timer ITIM3 Block current consumption at 48 MHz – – 620 µA 16-bit timer Min FCLK Typ – Max 48 Units MHz Table 21.
PAGE 20
CYBLE-222014-01 PRELIMINARY Pulse Width Modulation (PWM) Table 24. PWM DC Specifications Parameter Description Min Typ Max Units Details/Conditions IPWM1 Block current consumption at 3 MHz – – 43 µA 16-bit PWM IPWM2 Block current consumption at 12 MHz – – 152 µA 16-bit PWM IPWM3 Block current consumption at 48 MHz – – 620 µA 16-bit PWM Min Typ Max Units Table 25.
PAGE 21
CYBLE-222014-01 PRELIMINARY Serial Communication Table 28. Fixed I2C DC Specifications Parameter Description II2C1 Block current consumption at 100 kHz II2C2 Block current consumption at 400 kHz II2C3 Block current consumption at 1 Mbps 2 I C enabled in Deep-Sleep mode II2C4 Min Typ Max Units Details/Conditions – – 50 µA – – – 155 µA – – – 390 µA – – – 1.4 µA – Min Typ Max Units Details/Conditions – – 1 Mbps Table 29.
PAGE 22
CYBLE-222014-01 PRELIMINARY Memory Table 36. Flash DC Specifications Parameter Description Min Typ Max Units Details/Conditions 1.71 – 5.5 V – VPE Erase and program voltage TWS48 Number of Wait states at 32–48 MHz 2 – – CPU execution from flash TWS32 Number of Wait states at 16–32 MHz 1 – – CPU execution from flash TWS16 Number of Wait states for 0–16 MHz 0 – – CPU execution from flash Min Typ Max Units Table 37.
PAGE 23
CYBLE-222014-01 PRELIMINARY Voltage Monitors (LVD) Table 42. Voltage Monitor DC Specifications Parameter VLVI1 Description LVI_A/D_SEL[3:0] = 0000b Min 1.71 Typ 1.75 Max 1.79 Units V Details/Conditions – VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 V – VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 V – VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 V – VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 V – VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.
PAGE 24
CYBLE-222014-01 PRELIMINARY Internal Main Oscillator Table 45. IMO DC Specifications Parameter Description Min Typ Max Units Details/Conditions IIMO1 IMO operating current at 48 MHz – – 1000 µA – IIMO2 IMO operating current at 24 MHz – – 325 µA – IIMO3 IMO operating current at 12 MHz – – 225 µA – IIMO4 IMO operating current at 6 MHz – – 180 µA – IIMO5 IMO operating current at 3 MHz – – 150 µA – Table 46.
PAGE 25
CYBLE-222014-01 PRELIMINARY Parameter Details/ Conditions Description Min Typ Max Units CI2 Adjacent channel interference Wanted signal at –67 dBm and Interferer at FRX ±1 MHz – 3 15 dB RF-PHY Specification (RCV-LE/CA/03/C) CI3 Adjacent channel interference Wanted signal at –67 dBm and Interferer at FRX ±2 MHz – –29 – dB RF-PHY Specification (RCV-LE/CA/03/C) CI4 Adjacent channel interference Wanted signal at –67 dBm and Interferer at FRX ±3 MHz – –39 – dB RF-PHY Specification (R
PAGE 26
CYBLE-222014-01 PRELIMINARY Parameter Description Min Typ Max 0.8 – – Units Details/ Conditions EO Eye opening = F2AVG/F1AVG FTX, ACC Frequency accuracy –150 – 150 kHz FTX, MAXDR Maximum frequency drift –50 – 50 kHz FTX, INITDR Initial frequency drift –20 – 20 kHz FTX, DR Maximum drift rate –20 – 20 In-band spurious emission at 2-MHz offset IBSE2 In-band spurious emission at 3-MHz offset TXSE1 Transmitter spurious emissions (average), <1.
PAGE 27
CYBLE-222014-01 PRELIMINARY Parameter Min Typ Max Units BLE.IDLE to BLE. RX transition time – 75 120 µs RSSI, ACC RSSI accuracy – ±5 – dB RSSI, RES RSSI resolution – 1 – dB RSSI, PER RSSI sample period – 6 – µs IDLE2RX Description Details/ Conditions RSSI Specifications Document Number: 002-11186 Rev.
PAGE 28
CYBLE-222014-01 PRELIMINARY Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
PAGE 29
PRELIMINARY CYBLE-222014-01 Regulatory Information FCC FCC NOTICE: The device CYBLE-222014-01, including the antenna 2450AT18B100 from Johanson Technology, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.
PAGE 30
PRELIMINARY CYBLE-222014-01 Industry Canada (IC) Certification CYBLE-222014-01 is licensed to meet the regulatory requirements of Industry Canada (IC), License: IC: TBD Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
PAGE 31
PRELIMINARY CYBLE-222014-01 MIC Japan CYBLE-222014-01 is certified as a module with type certification number TBD. End products that integrate CYBLE-222014-01 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. KC Korea CYBLE-222014-01 is certified for use in Korea with certificate number TBD. Document Number: 002-11186 Rev.
PAGE 32
CYBLE-222014-01 PRELIMINARY Packaging Table 52. Solder Reflow Peak Temperature Module Part Number Package CYBLE-222014-01 22-pad SMT Maximum Peak Temperature Maximum Time at PeakTemperature 260 °C 30 seconds No. of Cycles 2 Table 53. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package MSL CYBLE-222014-01 22-pad SMT MSL 3 The CYBLE-222014-01 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the CYBLE-222014-01. Figure 10.
PAGE 33
PRELIMINARY CYBLE-222014-01 Figure 12 details reel dimensions used for the CYBLE-222014-01. Figure 12. Reel Dimensions The CYBLE-222014-01 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-222014-01 is detailed in Figure 13. Figure 13. CYBLE-222014-01 Center of Mass Document Number: 002-11186 Rev.
PAGE 34
CYBLE-222014-01 PRELIMINARY Ordering Information The CYBLE-222014-01 part number and features are listed in the following table. Part Number CPU Speed (MHz) Flash Size (KB) DMA CapSense SCB TCPWM 12-Bit SAR ADC I2S LCD Package Packing CYBLE-222014-01 48 256 Yes Yes 2 4 1 Msps Yes Yes 22-SMT Tape and Reel Part Numbering Convention The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows.
PAGE 35
PRELIMINARY CYBLE-222014-01 Acronyms Acronym Description BLE Bluetooth Low Energy Bluetooth SIG Bluetooth Special Interest Group CE European Conformity CSA Canadian Standards Association DMA direct memory access EMI electromagnetic interference ESD electrostatic discharge FCC Federal Communications Commission GPIO general-purpose input/output IC Industry Canada IDE integrated design environment KC Korea Certification MIC Ministry of Internal Affairs and Communications (Japan) P
PAGE 36
CYBLE-222014-01 PRELIMINARY Document History Page Document Title: CYBLE-222014-01, EZ-BLE™ PRoC™ Bluetooth 4.2 Module Document Number: 002-11186 Revision ECN Orig. of Change ** 5142440 DSO Submission Date Description of Change 02/18/2016 Preliminary datasheet for CYBLE-222014-01 module. Document Number: 002-11186 Rev.
PAGE 37
PRELIMINARY CYBLE-222014-01 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products ARM® Cortex® Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers cypress.com/clocks Interface Lighting & Power Control cypress.com/interface cypress.