Specifications

Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
PVIN, VDD to SGND −0.2V to +6V
PGND to SGND, PVIN to VDD −0.2V to +0.2V
EN, EAOUT, EANEG, SYNC/MODE
to SGND −0.2V to +6V
FB, SW (GND −0.2V) to
(VDD +0.2V)
Storage Temperature Range −45˚C to +150˚C
Lead Temperature
(Soldering, 10 sec.) 260˚C
Junction Temperature (Note 2) −25˚C to +125˚C
Minimum ESD Rating
±
2kV
(Human Body Model, C = 100 pF, R = 1.5 kΩ)
Thermal Resistance (θ
JA
) (Note 3) 140˚C/W
Electrical Characteristics
Specifications with standard typeface are for T
A
=T
J
= 25˚C, and those in boldface type apply over the full Operating Tem-
perature Range of T
A
=T
J
= −25˚C to +85˚C. Unless otherwise specified, PVIN = VDD = EN = SYNC/MODE = 3.6V.
Symbol Parameter Conditions Min Typ Max Units
V
IN
Input Voltage Range PVIN = VDD = V
IN
(Note 4) 2.8 3.6 5.5 V
V
FB
Feedback Voltage 1.485 1.50 1.515 V
V
HYST
PFM Comparator Hysteresis
Voltage
PFM Mode (SYNC/MODE =
0V) (Note 5)
24 mV
I
SHDN
Shutdown Supply Current VIN = 3.6V, EN = 0V 0.02 3 µA
I
Q1_PWM
DC Bias Current into VDD SYNC/MODE = VIN
FB=2V
600 725 µA
I
Q2_PFM
SYNC/MODE = 0V
FB=2V
160 195 µA
R
DSON (P)
Pin-Pin Resistance for
P FET
395 550 mΩ
R
DSON (N)
Pin-Pin Resistance for
N FET
330 500 mΩ
R
DSON (TC)
FET Resistance
Temperature Coefficient
0.5 %/C
I
LIM
Switch Peak Current Limit
(Note 6)
LM2614ATL 510 690 850
mA
LM2614BTL 400 690 980
V
IH
Logic High Input, EN,
SYNC/MODE
0.95 1.3 V
V
IL
Logic Low Input, EN,
SYNC/MODE
0.4 0.80 V
F
SYNC
SYNC/MODE Clock
Frequency Range
(Note 7)
500 1000 kHz
F
OSC
Internal Oscillator
Frequency
LM2614ATL, PWM Mode 468 600 732
kHz
LM2614BTL, PWM Mode 450 600 750
T
min
Minimum ON-Time of PFET
Switch in PWM Mode
200 ns
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but device specifications may not be guaranteed. For guaranteed specifications and associated test conditions, see the Min and Max limits and Conditions
in the Electrical Characteristics table. Typical (typ) specifications are mean or average values at 25˚C and are not guaranteed.
Note 2: Thermal shutdown will occur if the junction temperature exceeds 150˚C.
Note 3: Thermal resistance specified with 2 layer PCB (0.5/0.5 oz. cu).
Note 4: The LM2614 is designed for mobile phone applications where turn-on after system power-up is controlled by the system controller. Thus, it should be kept
in shutdown by holding the EN pin low until the input voltage exceeds 2.8V.
Note 5: The hysteresis voltage is the minimum voltage swing on the FB pin that causes the internal feedback and control circuitry to turn the internal PFET switch
on and then off during PFM mode. When resistor dividers are used like in the operating circuit of Figure 4, the hysteresis at the output will be the value of the
hysteresis at the feedback pin times the resistor divider ratio. In this case, 24mV (typ) x ((46.4k + 33.2k)/33.2k).
Note 6: Current limit is built-in, fixed, and not adjustable. If the current limit is reached while the voltage at the FB pin is pulled below 0.7V, the internal PFET switch
turns off for 2.5µs to allow the inductor current to diminish.
Note 7: SYNC driven with an external clock switching between V
IN
and GND. When an external clock is present at SYNC; the IC is forced to be in PWM mode at
the external clock frequency. The LM2614 synchronizes to the rising edge of the external clock.
LM2614
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