Datasheet

cui.com
CUI Inc │ SERIES: PRF20 │ DESCRIPTION: DC-DC CONVERTER date 02/12/2014 │ page 3 of 6
1.00
[25.4]
0.10
[2.5]
1.800
Bottom View
PCB Layout
Top View
Front View
[45.72]
2.00
[50.8]
0.22
min.
[5.6]
0.040
[1.02]
621
0.200
[5.08]
0.600
[15.24]
0.20 [5.1]
0.40
[10.2]
0.10
[2.5]
354
0.400
[10.16]
0.400
[10.16]
1.00
[25.4]
0.10
[2.5]
1.800
[45.72]
2.00
[50.8]
621
0.200
[5.08]
0.600
[15.24]
0.20 [5.1]
0.10
[2.5]
354
0.400
[10.16]
0.400
[10.16]
ENVIRONMENTAL
parameter conditions/description min typ max units
operating temperature see derating curve -40 85 °C
storage temperature -55 125 °C
humidity non-condensing 95 %
case temperature 105 °C
vibration EN50155 (EN61373)
SOLDERABILITY
parameter conditions/description min typ max units
wave soldering see wave soldering profi le 260 °C
MECHANICAL
parameter conditions/description min typ max units
dimensions 2.00 x 1.00 x 0.40 (50.8 x 25.4 x 10.2 mm) inch
case material black coated copper with non-conductive base
weight 35 g
MECHANICAL DRAWING
0
50
100
150
200
250
300
0 20 40 60 80 100 120 140 160 180
Time (Seconds)
Temperature (°C)
Notes: 1. Soldering materials: Sn/Cu/Ni
2. Ramp up rate during preheat: 1.4°C/s (from 50°C to 100°C)
3. Soaking temperature: 0.5°C/s (from 100°C to 130°C), 60±20 seconds
4. Peak temperature: 260°C, above 250°C for 3~6 seconds
5. Ramp down rate during cooling: -10°C/s (from 260°C to 150°C)
units: inch[mm]
tolerance: X.XX = ±0.02[±0.5]
X.XXX = ±0.010[±0.25]
1.3 mm Plated Through hole
2.5 mm Pad Size
PIN CONNECTIONS
Pin Single Dual
1 +Vin +Vin
2 -Vin -Vin
3 +Vout +Vout
4 Trim -Vout
5 -Vout common
6 Remote ON/OFF
For more information, please visit the product page.