Datasheet

cui.com
date 11/07/2014 │ page 27 of 30CUI Inc │ SERIES: NQB-N │ DESCRIPTION: FULLY REGULATED ADVANCED BUS CONVERTERS
Soldering Information - Hole Mounting
The hole mounted product is intended for plated through
hole mounting by wave or manual soldering. The pin
temperature is specied to maximum to 270°C for
maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by
hand, care should be taken to avoid direct contact between
the hot soldering iron tip and the pins for more than a few
seconds in order to prevent overheating.
A no-clean ux is recommended to avoid entrapment of
cleaning uids in cavities inside the product or between
the product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Delivery Package Information
The products are delivered in antistatic injection molded
trays (Jedec design guide 4.10D standard) and in antistatic
trays.
Tray Specifications –SMD
Material
Antistatic PPE
Surface resistance
10
5
< Ohm/square < 10
Bakability
12
The trays can be baked at maximum
125°C for 48 hours
Tray thickness
14.50mm0.571 [inch]
Box capacity
20 products (2 full trays/box)
Tray weight
125g empty, 574g full tray
JEDEC standard tray for 2x5 = 10 products.
All dimensions in mm [inch]
Tolerances: X.x ±0.26 [0.01], X.xx ±0.13 [0.005]
Note: pick up positions refer to center of pocket.
See mechanical drawing for exact location on product.
For more information, please visit the product page.