Datasheet

3232
XLamp
®
XT-E HVW LED
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trademarks of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
32
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp XT-E HVW LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed
below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by the
manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and congurations of reow-soldering equipment.
Prole feature Lead-based solder Lead-free solder
Average ramp-up rate (Ts
MAX
to Tp) 3 °C/second max. 3 °C/second max.
Preheat: Temperature min (Ts
MIN
) 100 °C 150 °C
Preheat: Temperature max (Ts
MAX
) 150 °C 200 °C
Preheat: Time (ts
MIN
to ts
MAX
) 60-120 seconds 60-180 seconds
Time maintained above: temperature (TL) 183 °C 217 °C
Time maintained above: time (tL) 60-150 seconds 60-150 seconds
Peak/classication temperature (Tp) 215 °C 260 °C
Time within 5 °C of actual peak temperature (tp) 10-30 seconds 20-40 seconds
Ramp-down rate 6 °C/second max. 6 °C/second max.
Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.