Datasheet

3333
xlamp
®
xT-E lEDs
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks
of Cree, Inc.
33
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.
33
REFLOW SOLDERING CHARACTERISTICS
Intesting, Creehasfound XLampXT-ELEDs to becompatible with JEDECJ-STD-020C, usingtheparameterslisted
below.Asageneralguideline,Creerecommendsthatusersfollowtherecommendedsolderingproleprovidedbythe
manufacturer of solder paste used.
NotethatthisgeneralguidelinemaynotapplytoallPCBdesignsandcongurationsofreowsolderingequipment.
Prole Feature Lead-Based Solder Lead-Free Solder
AverageRamp-UpRate(Ts
max
to Tp) 3 °C/second max. 3 °C/second max.
Preheat:TemperatureMin(Ts
min
) 100 °C 150 °C
Preheat:TemperatureMax(Ts
max
) 150 °C 200 °C
Preheat:Time(ts
min
to ts
max
) 60-120 seconds 60-180 seconds
TimeMaintainedAbove:Temperature(T
L
) 183 °C 217 °C
TimeMaintainedAbove:Time(t
L
) 60-150 seconds 60-150 seconds
Peak/ClassicationTemperature(Tp) 215 °C 260 °C
TimeWithin5°CofActualPeakTemperature(tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate 6 °C/second max. 6 °C/second max.
Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to the topside of the package, measured on the package body surface.
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min