Datasheet

1313
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®
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®
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®
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13
xlamp
®
xQ-e leds
REFLOW SOLDERING CHARACTERISTICS
 

manufacturer of solder paste used.

Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp)  
Preheat: Temperature Min (Ts
min
) 100 °C 150 °C
Preheat: Temperature Max (Ts
max
) 150 °C 200 °C
Preheat: Time (ts
min
to ts
max
) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (T
L
) 183 °C 217 °C
Time Maintained Above: Time (t
L
) 60-150 seconds 60-150 seconds
 215 °C 260 °C
Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate  
Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.