Datasheet
PRODUCT FAMILY DATA SHEET
Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo
and XLamp
®
are registered trademarks of Cree, Inc.
CLD-DS57 REV 3
Cree
®
XLamp
®
XQ-B LED
PRODUCT DESCRIPTION
Cree XLamp
®
XQ-B LEDs
revolutionize mid-power LEDs by
delivering lighting-class reliability
and a wider spread of light than
typical plastic packages. The
XQ-B’s innovative wide light
emission enables a smooth look in
replacement tubes and panel lights
while reducing system cost by using
fewer LEDs.
Using Cree’s newest generation of
silicon carbide-based LED chips,
XQ-B is optimized to dramatically
lower system cost in non-directional
and outdoor area lighting
applications.
FEATURES
• Cree’s smallest lighting class
LED: 1.6 X 1.6 X 1.6 mm
• Available in white, 80-minimum
CRI white and 70-minimum CRI
cool white
• 300 mA maximum drive current
• Low thermal resistance:
17 °C/W
• Wide viewing angle: 140°
• Reowsolderable-JEDEC
J-STD-020Ccompatible
• Unlimitedoorlifeat
≤30°C/85%RH
• RoHS-andREACh-compliant
• UL-recognized component
(E349212)
WWW.CREE.COM/XLAMP
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
TABLE OF CONTENTS
Characteristics ......................... 2
Flux Characteristics ................... 2
Relative Spectral Power
Distribution.............................. 3
RelativeFluxvs.Junction
Temperature ............................ 3
Electrical Characteristics ............ 4
Relative Flux vs. Current ........... 4
Typical Spatial Distribution ......... 5
Thermal Design ........................ 5
ReowSolderingCharacteristics . 6
Notes ...................................... 7
Mechanical Dimensions.............. 9
Tape and Reel ........................ 10
Packaging .............................. 11










