Datasheet

Copyright © 2009-2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-
marks of Cree, Inc.
3
XLAMP XP-G LEDS
CHARACTERISTICS
Characteristics Unit Minimum Typical Maximum
Thermal resistance, junction to solder point °C/W 6
Viewing angle (FWHM) degrees 125
Temperature coefcient of voltage mV/°C -2.1
ESD classication (HBM per Mil-Std-883D) Class 2
DC forward current mA 1500
Reverse voltage V 5
Forward voltage (@ 350 mA) V 3.0 3.75
Forward voltage (@ 700 mA) V 3.2
Forward voltage (@ 1000 mA) V 3.3
LED junction temperature °C 150
* The increase of maximum forward current to 1500 mA for XLamp XP-G Cool White is retroactive and applies to all XLamp XP-G Cool
White LEDs produced by Cree. The increase is the result of more extensive qualication testing that was performed after the initial
product launch.