Datasheet

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®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc.
8
XLamp
®
Xp-g Leds
REFLOW SOLDERING CHARACTERISTICS
  

manufacturer of solder paste used.

Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp)  

min
)  

max
)  
Preheat: Time (ts
min
to ts
max
) 60-120 seconds 60-180 seconds

L
)  

L
) 60-150 seconds 60-150 seconds
  
 10-30 seconds 20-40 seconds
Ramp-Down Rate  
 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min