Datasheet

1818
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®
, the Cree logo and XLamp
®
are registered trademarks of Cree, Inc. UL
®
and
the UR logo are registered trademarks of UL LLC.
18
XLAMP
®
XP-E LED
REFLOW SOLDERING CHARACTERISTICS
-RXIWXMRK'VIILEWJSYRH<0EQT<4)0)(WXSFIGSQTEXMFPI[MXL.)()'.78('YWMRKXLITEVEQIXIVWPMWXIHFIPS[%WEKIRIVEP
KYMHIPMRI'VIIVIGSQQIRHWXLEXYWIVWJSPPS[XLIVIGSQQIRHIHWSPHIVMRKTVSƤPITVSZMHIHF]XLIQERYJEGXYVIVSJXLIWSPHIVTEWXIYWIH
2SXIXLEXXLMWKIRIVEPKYMHIPMRIQE]RSXETTP]XSEPP4'&HIWMKRWERHGSRƤKYVEXMSRWSJVIƥS[WSPHIVMRKIUYMTQIRX
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Ts
max
XS8T Ʌq'WIGSRH
Preheat: Temperature Min (Ts
min
 q'
Preheat: Temperature Max (Ts
max
 q'
Preheat: Time (ts
min
to ts
max
 65-150 seconds
Time Maintained Above: Temperature (T
L
 q'
Time Maintained Above: Time (t
L
 WIGSRHW
4IEO'PEWWMƤGEXMSR8IQTIVEXYVI8T q'
8MQI;MXLMRɅq'SJ%GXYEP4IEO8IQTIVEXYVIXT WIGSRHW
Ramp-Down Rate q'WIGSRH
8MQIɅq'XS4IEO8IQTIVEXYVI QMRYXIWQE\
Note: All temperatures refer to topside of the package, measured on the package body surface.
-4'.)()'.78('
T
P
T
L
Temperature
Time
X¢'XS4IEO
Preheat
ts
t
S
t
P
25
6EQTHS[R
Ramp-up
'VMXMGEP>SRI
T
L
XS8
P
Ts
max
Ts
QMR