Datasheet

Copyright © 2010-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered
trademarks of Cree, Inc. ENERGY STAR
®
is a registered trademark of the U.S. Environmental Protection Agency.
9
xlamp
®
xp-e high-efficiency white leds
9



manufacturer of solder paste used.

  
Average Ramp-Up Rate (Ts
max
 3 °C/second max. 3 °C/second max.
Preheat: Temperature Min (Ts
min
 100 °C 150 °C
Preheat: Temperature Max (Ts
max
 150 °C 200 °C
Preheat: Time (ts
min
to ts
max
 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (T
L
 183 °C 217 °C
Time Maintained Above: Time (t
L
 60-150 seconds 60-150 seconds
 215 °C 260 °C
 10-30 seconds 20-40 seconds
Ramp-Down Rate 6 °C/second max. 6 °C/second max.
Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.