Datasheet


Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and XLamp
®
are registered trade-
marks of Cree, Inc. UL
®
and the UR logo are registered trademarks of UL LLC.

xlAMP
®
xP-c lEDS
REFLOW SOLDERING CHARACTERISTICS
      

manufacturer of solder paste used.

Prole Feature Lead-Based Solder Lead-Free Solder


  

min
 100 °C 150 °C


 150 °C 200 °C

min
to ts

  

L
  217 °C

L
  
 215 °C 
  
Ramp-Down Rate  
Time 25 °C to Peak Temperature  
