Datasheet

Copyright © 2013-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo, XLamp
®
and SC³ Technology
®
are registered trademarks of Cree, Inc. ENERGY STAR
®
is a registered trademark of the U.S. Environmental Protection Agency.
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xlamp
®
xB-E HVW lEds
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REFLOW SOLDERING CHARACTERISTICS


manufacturer of solder paste used.
ipment.
Prole Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts
max
to Tp)  
Preheat: Temperature Min (Ts
min
) 100 °C 150 °C
Preheat: Temperature Max (Ts
max
) 150 °C 200 °C
Preheat: Time (ts
min
to ts
max
) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (T
L
) 183 °C 217 °C
Time Maintained Above: Time (t
L
) 60-150 seconds 60-150 seconds
 215 °C 260 °C
Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-Down Rate  
Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
T
P
T
L
Temperature
Time
t 25˚C to Peak
Preheat
ts
t
S
t
P
25
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P
Ts
max
Ts
min