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PRODUCT FAMILY DATA SHEET

, the

Cree logo, XLamp

and SC³ Technology

are registered trademarks of Cree, Inc. ENERGY STAR

is a registered trademark of the U.S.

Environmental Protection Agency.

CLD-DS75 REV 2

Cree

XLamp

XB-E High-Voltage White LEDs

PRODUCT DESCRIPTION

Built on Cree’s SC³ Technology

Platform, the XLamp

XB-E

High-Voltage White (HVW) LED is

optimized to lower cost for high-

lumen, omnidirectional replacement

lamps. The XB-E HVW LED delivers

     

footprint and enables smaller and

    

standard-voltage LEDs. In addition,

the XB-E LED has a wider light

distribution that can improve the

omnidirectionality of ENERGY STAR

replacement lamps.

FEATURES

 Binned @ 85 °C & 44mA

 Available in 80-minimum CRI

 125 mA maximum drive

current

 23.5 V typical forward voltage

@ 85 °C, 44 mA

 Wide viewing angle: 140°

 



 



 Electrically neutral thermal

path

 UL-recognized component

(E349212)



Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

TABLE OF CONTENTS

Characteristics ......................... 2

Flux Characteristics ................... 2

Relative Spectral Power

Distribution.............................. 3

Electrical Characteristics ............ 3

Relative Flux vs. Current ........... 4

Typical Spatial Distribution ......... 4

Thermal Design ........................ 5

 . 6

Notes ...................................... 7

Mechanical Dimensions.............. 8

Tape and Reel .......................... 9

Packaging .............................. 10

Summary of content (10 pages)

PAGE 1
® ® Cree XLamp XB-E High‑Voltage White LEDs PRODUCT DESCRIPTION FEATURES Table of Contents Built on Cree’s SC³ Technology® • Binned @ 85 °C & 44mA Characteristics.......................... 2 XB‑E • Available in 80-minimum CRI Flux Characteristics.................... 2 High‑Voltage White (HVW) LED is • 125 mA maximum drive Relative Spectral Power current Distribution.............................. 3 23.5 V typical forward voltage Electrical Characteristics.............
PAGE 2
xlamp ® xB-E HVW leds Characteristics Characteristics Unit Thermal resistance, junction to solder point °C/W 6.5 degrees 140 mV/°C -19 Viewing angle (FWHM) Temperature coefficient of voltage Minimum ESD classification (HBM per Mil-Std-883D) Typical Maximum Class 2 DC forward current mA 125 Reverse voltage V 0.1 Forward voltage (@ 44 mA, 85 °C) V LED junction temperature °C 23.5 26.
PAGE 3
xlamp ® xB-E HVW leds Relative Spectral Power - XB-E Relative Spectral Power Distribution Relative Radiant Power (%) 100 80 60 2600K - 3700K CCT 3700K - 5000K CCT 40 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Electrical Characteristics (TJ = 85 °C) Electrical Characteristics (Tj = 85ºC) - XB-E - tall dome 125 Forward Current (mA) 100 75 50 25 0 21.0 22.0 23.0 24.0 25.0 26.0 27.0 Forward Voltage (V) Copyright © 2013-2014 Cree, Inc. All rights reserved.
PAGE 4
xlamp ® xB-E HVW leds Relative Intensity vs. Current (Tj = 85ºC) - XB-E tall dome Relative Flux vs. Current (TJ = 85 °C) Relative Luminous Flux (%) 250 200 150 100 50 0 0 25 50 75 100 125 Forward Current (mA) Typical Spatial Radiation Pattern - XB-E tall dome Typical Spatial Distribution Relative Luminous Intensity (%) 120 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Copyright © 2013-2014 Cree, Inc. All rights reserved.
PAGE 5
xlamp ® xB-E HVW leds Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is Thermal Design - XB-E crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.
PAGE 6
xlamp ® xB-E HVW leds Reflow Soldering Characteristics In testing, Cree has found XLamp XB-E HVW LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment.
PAGE 7
xlamp ® xB-E HVW leds Notes Measurements The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products.
PAGE 8
xlamp ® xB-E HVW leds 6 6 5 5 4 3 3 2 Mechanical Dimensions 6 5 2 NOTICE 5 CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION NOTICEARE THE PROPRIETARY AND CONTAINED WITHIN CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED THE PROPRIETARY MAY WITHIN NOT BEARE COPIED, REPRODUCED AND OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, OF CREE INC.
PAGE 9
6 DETAIL B SCALE 2 : 1 5 4 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC.
PAGE 10
xlamp ® xB-E HVW leds Packaging Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code,