Datasheet

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Subject to change without notice.
www.cree.com/xlamp
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Cree
®
XLamp
®
MC-E LED
Data Sheet
The XLamp MC-E LED is a lighting-class, multi-chip LED that provides high lumen
output in a small footprint package. Compared to discrete LEDs, XLamp MC-E LEDs
reduce the distance between LED die, creating a small optical source for excellent
optical control and efcient color mixing. XLamp MC-E LEDs can reduce LED system
complexity by reducing the number of components required.
Cree XLamp LEDs bring high performance and quality of light to a wide range of
lighting applications, including color-changing lighting, portable and personal lighting,
outdoor lighting, indoor directional lighting, and entertainment lighting.
FEATURES
• Available in white (2600 K – 10,000 K CCT) or color (RGBW)
• ANSI-compatible neutral & warm white chromaticity bins
• Individually addressable LEDs
• Maximum drive current: 700 mA per LED die
• Reow solderable – JEDEC J-STD-020
• Electrically neutral thermal path
• RoHS and REACH-compliant
Table of Contents
Flux Characteristics (T
J
= 25°C) .................................................................................................................2
Characteristics - Complete Package ............................................................................................................2
Characteristics - Per LED Die (White) .........................................................................................................3
Characteristics - Per LED Die (Color) ..........................................................................................................3
Relative Spectral Power Distribution (I
F
= 350 mA per LED) - White ................................................................4
Relative Spectral Power Distribution (I
F
= 350 mA per LED) - Color ................................................................4
Relative Flux Output vs Junction Temperature (I
F
= 350 mA) .........................................................................5
Electrical Characteristics (T
J
= 25˚C) ..........................................................................................................6
Relative Intensity vs. Current (T
J
= 25˚C) ...................................................................................................6
Typical Spatial Radiation Pattern ................................................................................................................7
Reow Soldering Characteristics ................................................................................................................8
Notes .....................................................................................................................................................9
Mechanical Dimensions........................................................................................................................... 10
Tape and Reel ....................................................................................................................................... 11
Dry Packaging and Packaging .................................................................................................................. 12