Specifications

80 Control and Automation Solutions Guide
Proximity Sensors
Part Description Features Benefits
Proximity Sensors
MAX44000 Integrated proximity sensor and
ambient light sensor
7µA low-power IR-based reliable
proximity sensor integrated with
0.03lx sensitive ambient light
sensor
Single IC provides proximity and
light sensing with wide dynamic
range and digital functions
for reliable sensing in harsh
environments.
MAX44005* RGB-IR-ambient-temperature
sensor integrated with proximity
sensor
12µA low-power multiband
light sensor with temperature
compensation and high sensitive
proximity sensor
High-performance proximity
sensor integrated with multiband
light sensor for fast and reliable
color digitization.
MAX9621 Dual, 2-wire Hall-effect sensor
interface with analog and digital
outputs
Wide supply range with supply
transient detection; filtered digital
and analog outputs for wide range
of interfaces
Provides flexibility and cost saving
for Hall-effect sensor applications.
Sensor Communications Interface
Part Description Features Benefits
Interface Transceivers
MAX14820 300mA IO-Link device transceiver High C/Q driver capability up
to 1µF, protected V
P
, wake-up
detection
Allows heavy capacitive loads.
MAX14821 100mA IO-Link device transceiver Tiny 2.5mm x 2.5mm WLP form
factor, protected V
P
, wake-up
detection
Reduces board area; offers flexible
power options; simplifies firmware
development.
MAX14824 IO-Link master transceiver with
300mA drive
IO-Link v.1.0, v.1.1 compliant;
COM1, COM2, COM3 data rates
Feature integration saves space.
MAX14830 IO-Link UART IO-Link 1.1 compliant quad-
channel, 128-word FIFO
Extends functionality of
microcontroller.
MAX13485E/86E Half-duplex RS-485/422
transceivers in µDFN
8-pin, 2mm x 2mm, µDFN package;
hot-swap capable, ±15kV ESD
protection
Smallest package and internal
protection circuitry yield
extreme board space savings and
ruggedness.
MAX13430E/1E/2E/3E RS-485 family with low-voltage
logic interface in TDFN-EP and
µMAX packages
10-/14-pin, 3mm x 3mm, TDFN-
EP and µMAX; low-voltage logic
interface down to +1.62V, ±30kV
ESD HBM
Tiny package, integrated logic
level translator and ESD circuitry
yield smallest board footprint
solution.
*Future product—contact the factory for availability.