Product Folder Order Now Technical Documents Tools & Software Support & Community CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 CC2642R SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU 1 Device Overview 1.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 1.2 • • • • • • www.ti.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 The CC2642R device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 1.4 www.ti.com Functional Block Diagram 2.4 GHz CC26x2R RF Core cJTAG Main CPU 256KB ROM ADC ADC Arm® Cortex®-M4F Processor Up to 352KB Flash with 8KB Cache 48 MHz 71 μA/MHz (3.0 V) Up to 80KB SRAM with Parity Digital PLL DSP Modem 16KB SRAM Arm® Cortex®-M0 Processor ROM General Hardware Peripherals and Modules Sensor Interface I2C and I2S 4× 32-bit Timers ULP Sensor Controller 2× UART 2× SSI (SPI) 8-bit DAC 32 ch.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Table of Contents 1 Device Overview ......................................... 1 .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagram ............................ 4 Revision History ......................................... 5 Device Comparison .....................................
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 3 Device Comparison Table 3-1. Device Family Overview RADIO SUPPORT FLASH (KB) RAM (KB) GPIO PACKAGE SIZE CC1312R Sub-1 GHz 352 80 30 RGZ (7-mm × 7-mm VQFN48) CC1352P Multiprotocol Sub-1 GHz Bluetooth 5.1 Low Energy Zigbee Thread 2.4 GHz proprietary FSK-based formats +20-dBm high-power amplifier 352 80 26 RGZ (7-mm × 7-mm VQFN48) CC1352R Multiprotocol Sub-1 GHz Bluetooth 5.1 Low Energy Zigbee Thread 2.
CC2642R www.ti.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 4.2 www.ti.com Signal Descriptions – RGZ Package Table 4-1. Signal Descriptions – RGZ Package PIN NAME NO. I/O TYPE DESCRIPTION DCDC_SW 33 — Power Output from internal DC/DC converter (1) DCOUPL 23 — Power For decoupling of internal 1.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Table 4-1. Signal Descriptions – RGZ Package (continued) PIN I/O TYPE 45 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO (4) (2) (5) VDDR_RF 48 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO (6) (2) (5) VDDS 44 — Power 1.8-V to 3.8-V main chip supply (1) VDDS2 13 — Power 1.8-V to 3.8-V DIO supply (1) VDDS3 22 — Power 1.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VDDS (3) (2) MIN MAX Supply voltage –0.3 4.1 V Voltage on any digital pin (4) –0.3 VDDS + 0.3, max 4.1 V –0.3 VDDR + 0.3, max 2.25 V –0.
CC2642R www.ti.com 5.5 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Power Consumption - Power Modes When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. PARAMETER TEST CONDITIONS TYP UNIT Core Current Consumption Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150 Shutdown. No clocks running, no retention 150 RTC running, CPU, 80KB RAM and (partial) register retention. RCOSC_LF 0.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.6 www.ti.com Power Consumption - Radio Modes When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted. PARAMETER Radio receive current Radio transmit current 5.7 TYP UNIT 2440 MHz TEST CONDITIONS 6.9 mA 0 dBm output power setting 2440 MHz 7.3 mA +5 dBm output power setting 2440 MHz 9.
CC2642R www.ti.com 5.8 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Thermal Resistance Characteristics PACKAGE THERMAL METRIC RGZ (VQFN) (1) UNIT 48 PINS RșJA Junction-to-ambient thermal resistance 23.4 °C/W (2) RșJC(top) Junction-to-case (top) thermal resistance 13.3 °C/W (2) RșJB Junction-to-board thermal resistance 8.0 °C/W (2) ȥJT Junction-to-top characterization parameter 0.1 °C/W (2) ȥJB Junction-to-board characterization parameter 7.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.10 Bluetooth Low Energy - Receive (RX) When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 125 kbps (LE Coded) Receiver sensitivity Differential mode.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Bluetooth Low Energy - Receive (RX) (continued) When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com Bluetooth Low Energy - Receive (RX) (continued) When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.11 Bluetooth Low Energy - Transmit (TX) When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. All measurements are performed conducted.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.12 Timing and Switching Characteristics Table 5-1. Reset Timing PARAMETER MIN RESET_N low duration TYP MAX UNIT 1 μs Table 5-2. Wakeup Timing Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not include software overhead.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.12.1 Clock Specifications Table 5-3. 48 MHz Crystal Oscillator (XOSC_HF) Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.12.2 Synchronous Serial Interface (SSI) Characteristics Table 5-8. Synchronous Serial Interface (SSI) Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER NO. PARAMETER MIN TYP 65024 UNIT S1 tclk_per SSIClk cycle time S2 (2) tclk_high SSIClk high time 0.5 tclk_per S3 (2) tclk_low SSIClk low time 0.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 S1 S2 SSIClk (SPO = 0) S3 SSIClk (SPO = 1) SSITx (Master) MSB SSIRx (Slave) MSB LSB LSB SSIFss Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 5.12.3 UART Table 5-9.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.13 Peripheral Characteristics 5.13.1 ADC Table 5-10. Analog-to-Digital Converter (ADC) Characteristics Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. (1) Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers. PARAMETER TEST CONDITIONS MIN Input voltage range TYP 0 Resolution 12 Sample Rate 200 LSB Gain error Internal 4.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Table 5-10. Analog-to-Digital Converter (ADC) Characteristics (continued) Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1) Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers. PARAMETER TEST CONDITIONS Reference voltage VDDS as reference, input voltage scaling disabled Input impedance 200 kSamples/s, voltage scaling enabled.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.13.2 DAC Table 5-11. Digital-to-Analog Converter (DAC) Characteristics Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT General Parameters Resolution VDDS Supply voltage Clock frequency FDAC Voltage output settling time 8 1.8 3.8 External Load (1), any VREF, pre-charge OFF, DAC chargepump OFF 2.0 3.8 Any load, VREF = DCOUPL, pre-charge ON 2.6 3.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Table 5-11. Digital-to-Analog Converter (DAC) Characteristics (continued) Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS VREF = VDDS = 3.8 V Max code output voltage variation (4) Load = Low Power Clocked Comparator Output voltage range (4) Load = Continuous Time Comparator Output voltage range (4) Load = Low Power Clocked Comparator MIN TYP MAX UNIT ±2.92 VREF =VDDS = 3.0 V ±3.06 VREF = VDDS = 1.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com Table 5-11. Digital-to-Analog Converter (DAC) Characteristics (continued) Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER Output voltage range Load = Low Power Clocked Comparator 26 TEST CONDITIONS MIN TYP VREF = VDDS = 3.8 V, code 1 0.03 VREF = VDDS = 3.8 V, code 255 3.61 VREF = VDDS = 3.0 V, code 1 0.02 VREF = VDDS = 3.0 V, code 255 2.85 VREF = VDDS = 1.8 V, code 1 0.02 VREF = VDDS = 1.8 V, code 255 1.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.13.3 Temperature and Battery Monitor Table 5-12. Temperature Sensor Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Resolution MAX UNIT 2 °C °C Accuracy -40 °C to 0 °C ±4.0 Accuracy 0 °C to 105 °C ±2.5 °C 3.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.13.4 Comparators Table 5-14. Low-Power Clocked Comparator Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Input voltage range Clock frequency MAX UNIT VDDS V SCLK_LF Internal reference voltage (1) Using internal DAC with VDDS as reference voltage, DAC code = 0 - 255 Offset Measured at VDDS / 2, includes error from internal DAC Decision time (1) TYP 0 0.024 - 2.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.13.6 GPIO Table 5-17. GPIO DC Characteristics PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = 25 °C, VDDS = 1.8 V GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 1.56 V GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.24 V GPIO VOH at 4 mA load IOCURR = 1 1.59 V GPIO VOL at 4 mA load IOCURR = 1 0.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.14 Typical Characteristics All measurements in this section are done with Tc = 25 °C and VDDS = 3.0 V, unless otherwise noted. See Recommended Operating Conditions, Section 5.3, for device limits. Values exceeding these limits are for reference only. 5.14.1 MCU Current Active Current vs. VDDS Running CoreMark, SCLK_HF = 48 MHz RCOSC 6 5.5 Current [mA] 5 4.5 4 3.5 3 2.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 Voltage [V] 3.6 3.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Standby Current vs. Temperature 80 kB RAM Retention, no Cache Retention, RTC On SCLK_LF = 32 kHz XOSC 12 Current [μA] 10 8 6 4 2 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature [°C] D006 Figure 5-5. Standby Mode (MCU) Current vs. Temperature 5.14.2 RX Current RX Current vs. Temperature Current [mA] BLE 1 Mbps, 2.44 GHz 8.5 8.4 8.3 8.2 8.1 8 7.9 7.8 7.7 7.6 7.5 7.4 7.3 7.2 7.1 7 6.9 6.8 6.7 6.6 6.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com RX Current vs. VDDS BLE 1 Mbps, 2.44 GHz 11.5 11 10.5 Current [mA] 10 9.5 9 8.5 8 7.5 7 6.5 6 5.5 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 Voltage [V] 3.6 3.8 D013 Figure 5-7. RX Current vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.14.3 TX Current TX Current vs. Temperature Current [mA] BLE 1 Mbps, 2.44 GHz, 0 dBm 9 8.85 8.7 8.55 8.4 8.25 8.1 7.95 7.8 7.65 7.5 7.35 7.2 7.05 6.9 6.75 6.6 6.45 6.3 6.15 6 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 100 D018 Figure 5-8. TX Current vs. Temperature (BLE 1 Mbps, 2.44 GHz) TX Current vs. VDDS BLE 1 Mbps, 2.44 GHz, 0 dBm 12 11.5 11 10.5 Current [mA] 10 9.5 9 8.5 8 7.5 7 6.5 6 5.5 5 1.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com Table 5-18 shows typical TX current and output power for different output power settings. Table 5-18. Typical TX Current and Output Power CC2642R at 2.4 GHz, VDDS = 3.0 V (Measured on CC2652REM-7ID) 34 txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA] 0x7217 5 4.9 9.5 0x4E63 4 3.9 9.0 0x385D 3 2.8 8.6 0x3259 2 1.8 8.0 0x2856 1 0.9 7.6 0x2853 0 -0.3 7.3 6.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.14.4 RX Performance Sensitivity vs. Frequency BLE 1 Mbps, 2.44 GHz -92 -93 Sensitivity [dBm] -94 -95 -96 -97 -98 -99 -100 -101 -102 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 Frequency [GHz] 2.48 D028 Figure 5-10. Sensitivity vs. Frequency (BLE 1 Mbps, 2.44 GHz) Sensitivity vs. Temperature BLE 1 Mbps, 2.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com Sensitivity vs. VDDS BLE 1 Mbps, 2.44 GHz -92 -93 Sensitivity [dBm] -94 -95 -96 -97 -98 -99 -100 -101 -102 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage [V] 3.8 D034 Figure 5-12. Sensitivity vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz) Sensitivity vs. VDDS BLE 1 Mbps, 2.44 GHz, DCDC Off -92 -93 Sensitivity [dBm] -94 -95 -96 -97 -98 -99 -100 -101 -102 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage [V] 3.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 5.14.5 TX Performance Output Power vs. Temperature Output Power [dBm] BLE 1 Mbps, 2.44 GHz, 0 dBm 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature [°C] D041 Figure 5-14. Output Power vs. Temperature (BLE 1 Mbps, 2.44 GHz) Output Power vs. Temperature Output Power [dBm] BLE 1 Mbps, 2.44 GHz, +5 dBm 7 6.8 6.6 6.4 6.2 6 5.8 5.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com Output Power vs. VDDS Output Power [dBm] BLE 1 Mbps, 2.44 GHz, 0 dBm 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Voltage [V] 3.8 D046 Figure 5-16. Output Power vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz) Output power vs. VDDS Output Power [dBm] BLE 1 Mbps, 2.44 GHz, +5 dBm 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.4 4.2 4 3.8 3.6 3.4 3.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Output Power vs. Frequency Output Power [dBm] BLE 1 Mbps, 2.44 GHz, 0 dBm 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 Frequency [GHz] 2.48 D058 Figure 5-18. Output Power vs. Frequency (BLE 1 Mbps, 2.44 GHz) Output Power vs. Frequency Output Power [dBm] BLE 1 Mbps, 2.44 GHz, +5 dBm 7 6.8 6.6 6.4 6.2 6 5.8 5.6 5.4 5.2 5 4.8 4.6 4.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 5.14.6 ADC Performance ENOB vs. Input Frequency 11.4 Internal Reference, No Averaging Internal Unscaled Reference, 14-bit Mode 11.1 ENOB [Bit] 10.8 10.5 10.2 9.9 9.6 0.2 0.3 0.5 0.7 1 2 3 4 5 6 7 8 10 20 30 40 50 Frequency [kHz] 70 100 D061 Figure 5-20. ENOB vs. Input Frequency ENOB vs. Sampling Frequency Vin = 3.0 V Sine wave, Internal reference, Fin = Fs / 10 10.2 10.15 ENOB [Bit] 10.1 10.05 10 9.95 9.9 9.85 9.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 INL vs. ADC Code Vin = 3.0 V Sine wave, Internal reference, 200 kSamples/s 1.5 1 INL [LSB] 0.5 0 -0.5 -1 -1.5 0 400 800 1200 1600 2000 2400 2800 3200 3600 ADC Code 4000 D064 Figure 5-22. INL vs. ADC Code DNL vs. ADC Code Vin = 3.0 V Sine wave, Internal reference, 200 kSamples/s 2.5 2 DNL [LSB] 1.5 1 0.5 0 -0.5 0 400 800 1200 1600 2000 2400 2800 ADC Code 3200 3600 4000 D065 Figure 5-23. DNL vs.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com ADC Accuracy vs. Temperature Vin = 1 V, Internal reference, 200 kSamples/s 1.01 1.009 1.008 Voltage [V] 1.007 1.006 1.005 1.004 1.003 1.002 1.001 1 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature [°C] 100 D066 Figure 5-24. ADC Accuracy vs. Temperature ADC Accuracy vs. VDDS Vin = 1 V, Internal reference, 200 kSamples/s 1.01 1.009 1.008 Voltage [V] 1.007 1.006 1.005 1.004 1.003 1.002 1.001 1 1.8 2 2.2 2.4 2.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 6 Detailed Description 6.1 Overview Section 1.4 shows the core modules of the CC2642R device. 6.2 System CPU The CC2642R SimpleLink™ Wireless MCU contains an Arm® Cortex®-M4F system CPU, which runs the application and the higher layers of radio protocol stacks.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 6.3 www.ti.com Radio (RF Core) The RF Core is a highly flexible and future proof radio module which contains an Arm Cortex-M0 processor that interfaces the analog RF and base-band circuitry, handles data to and from the system CPU side, and assembles the information bits in a given packet structure. The RF core offers a high level, command-based API to the main CPU that configurations and data are passed through.
CC2642R www.ti.com 6.4 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Memory The up to 352-KB nonvolatile (Flash) memory provides storage for code and data. The flash memory is insystem programmable and erasable. The last flash memory sector must contain a Customer Configuration section (CCFG) that is used by boot ROM and TI provided drivers to configure the device. This configuration is done through the ccfg.c source file that is included in all TI provided examples.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 6.5 www.ti.com Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in both Standby and Active power modes. The peripherals in this domain can be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously; thereby significantly reducing power consumption and offloading the system CPU.
CC2642R www.ti.com 6.6 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Cryptography The CC2642R device comes with a wide set of modern cryptography-related hardware accelerators, drastically reducing code footprint and execution time for cryptographic operations. It also has the benefit of being lower power and improves availability and responsiveness of the system because the cryptography operations runs in a background hardware thread.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 6.7 www.ti.com Timers A large selection of timers are available as part of the CC2642R device. These timers are: • Real-Time Clock (RTC) A 70-bit 3-channel timer running on the 32 kHz low frequency system clock (SCLK_LF) This timer is available in all power modes except Shutdown. The timer can be calibrated to compensate for frequency drift when using the LF RCOSC as the low frequency system clock.
CC2642R www.ti.com 6.8 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Serial Peripherals and I/O The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz. The SSI modules support configurable phase and polarity. The UARTs implement universal asynchronous receiver and transmitter functions. They support flexible baud-rate generation up to a maximum of 3 Mbps.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 6.12 Power Management To minimize power consumption, the CC2642R supports a number of power modes and power management features (see Table 6-1). Table 6-1.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 The Sensor Controller is an autonomous processor that can control the peripherals in Controller independently of the system CPU. This means that the system CPU does not have for example to perform an ADC sampling or poll a digital sensor over SPI, thus saving both wake-up time that would otherwise be wasted.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 7 Application, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
CC2642R www.ti.com 7.2 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Junction Temperature Calculation This section shows the different techniques for calculating the junction temperature under various operating conditions. For more details, see Semiconductor and IC Package Thermal Metrics. There are three recommended ways to derive the junction temperature from other measured temperatures: 1. From package temperature: (1) 2. From board temperature: (2) 3.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com 8 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed as follows. 8.1 Tools and Software The CC2642R device is supported by a variety of software and hardware development tools.
CC2642R www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Development Tools Code Composer Studio™ Integrated Development Environment (IDE) SPACER Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications.
CC2642R SWRS194G – JANUARY 2018 – REVISED APRIL 2020 www.ti.com CCS UniFlash SPACER CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs. UniFlash has a GUI, command line, and scripting interface. CCS UniFlash is available free of charge. 8.1.1 SimpleLink™ Microcontroller Platform The SimpleLink microcontroller platform sets a new standard for developers with the broadest portfolio of wired and wireless Arm® MCUs (System-on-Chip) in a single software development environment.
CC2642R www.ti.com 8.3 SWRS194G – JANUARY 2018 – REVISED APRIL 2020 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 8.
(1) ACTIVE CC2642R1FRGZT VQFN VQFN RGZ RGZ 48 48 250 2500 Package Type Package Pins Package Drawing Qty Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) (2) Eco Plan NIPDAU | NIPDAUAG NIPDAU | NIPDAUAG (6) Lead/Ball Finish Level-3-260C-168 HR Level-3-260C-168 HR (3) MSL Peak Temp (2) CC2642 R1F CC2642 R1F (4/5) Device Marking 6-Feb-2020 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2 • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects NOTE: Qualified Version Definitions: • Automotive: CC2642R-Q1 OTHER QUALIFIED VERSIONS OF CC2642R : www.ti.
PACKAGE MATERIALS INFORMATION www.ti.com 1-Nov-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC2642R1FRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC2642R1FRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.
PACKAGE MATERIALS INFORMATION www.ti.com 1-Nov-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2642R1FRGZR VQFN RGZ 48 2500 336.6 336.6 31.8 CC2642R1FRGZT VQFN RGZ 48 250 210.0 185.0 35.
GENERIC PACKAGE VIEW RGZ 48 VQFN - 1 mm max height PLASTIC QUADFLAT PACK- NO LEAD 7 x 7, 0.5 mm pitch Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224671/A www.ti.
PACKAGE OUTLINE RGZ0048A VQFN - 1 mm max height 3/$67,& 48$')/$7 3$&. 12 /($' $ % 3,1 ,1'(; $5($ 7<3 6,'( :$// '(7$,/ 237,21$/ 0(7$/ 7+,&.1(66 0$; & 6($7,1* 3/$1( & ; 7<3 ; 6<00 ; 3,1 ,' 237,21$/ 6(( 6,'( :$// '(7$,/ 6<00 ; ; & $ % & % 127(6 $OO OLQHDU GLPHQVLRQV DUH LQ PLOOLPHWHUV $Q\ GLPHQVLRQV LQ SDUHQWKHVLV DUH IRU UHIHUH
EXAMPLE BOARD LAYOUT RGZ0048A VQFN - 1 mm max height 3/$67,& 48$')/$7 3$&. 12 /($' ; 6<00 ; ; ; ; 6<00 ; ; ; 5 7<3 ; 9,$ 7<3 ; ; ; /$1' 3$77(51 (;$03/( 6&$/( ; 0,1 $// $5281' 0$; $// $5281' (;326(' 0(7$/ (;326(' 0(7$/ 62/'(5 0$6. 23(1,1* 62/'(5 0$6. 23(1,1* 0(7$/ 121 62/'(5 0$6. '(),1(' 35()(55(' 62/'(5 0$6. '(),1(' 62/'(5 0$6.
EXAMPLE STENCIL DESIGN RGZ0048A VQFN - 1 mm max height 3/$67,& 48$')/$7 3$&. 12 /($' ; 6<00 ; ; ; ; 6<00 ; ; ; 5 7<3 ; ; ; 62/'(5 3$67( (;$03/( %$6(' 21 PP 7+,&. 67(1&,/ (;326(' 3$' 35,17(' &29(5$*( %< $5($ 6&$/( ; % 127(6 FRQWLQXHG /DVHU FXWWLQJ DSHUWXUHV ZLWK WUDSH]RLGDO ZDOOV DQG URXQGHG FRUQHUV PD\ RIIHU EHWWHU SDVWH UHOHDVH ,3& PD\ KDYH DOWHUQDWH GHVLJQ UHFRPPHQGD
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