User's Manual

Table Of Contents
Installation RF Path Elements P/N 709C011801 Page 66
Draft
5 Installation RF Path Elements
This chapter describes the installation of the RF path components. For specific guidelines on infrastructure planning, design
and installation, please consult with a Corning Product Line Manager or Corning approved Installer.
5.1 Headend Elements
The (RF coverage) headend site installation consists of installing the HEU and OIU units.
Note the following information:
The chassis and modules are supplied separately and must be inserted by the user. Only the fan module is factory installed
in the chassis rear.
The headend elements are installed at the IDF (Intermediate Distribution Frame), adjacent (or as close as possible) to each
other to facilitate the connections. See section 5.1.1.2 for an optimal 4x4 HEU-OIU rack configuration in terms of location
in rack where each OIU is connected to each HEU.
The ERFC cable (Expander Cable interconnecting the (OIU/IHU) OIX and (HEU/IHU) RIX modules) are provided in lengths
ranging from 16 to 59 in so as to accommodate a range of HEU-OIU rack installation configurations.
Hot-swappable modules: RIM (RF Interface Modules) and Power Supply(ies), Fan Modules and RIX/OIX (Expander
Modules). HCM, ACM modules are not hot-swappable.
If a redundant power supply is provided, both supplies must be installed, connected to respective AC or DC power and
switched on.
The 4x4 configuration includes four HEU units connected to four OIU units. This is the maximum number of headend units
that can be managed by a single HCM.
The components of each system installation are control and managed via a single HCM which is installed in an HEU/IHU
chassis.
Note: The management connections for the Corning ONE™ system elements are detailed in the HCM UM.