FE4CNX210 OEM Manual and User Guide v 1.
Terms and Acronyms CDMA UMTS WCDMA LTE LTE-A GLONASS GNSS DCM-TCU DRX ES FDD GPIO GSM HU HSIC PCIe MP NAD OEM PCB PHY SIM TDD TSP Code Division Multiple Access Universal Mobile Telecommunication System Wideband Code Division Multiple Access Long Term Evolution LTE-Advanced GLObalnaya NAvigatsionnaya Sputnikovaya Sistema Global Navigation Satellite System Data Connectivity Module Discontinuous Reception Engineering Sample Frequency Division Duplex General Purpose Input Output Global System for Mobile USB ho
FE4CNX210 Module The FE4CNX210 NAD is a proprietary embedded module designed by Continental Automotive Systems, Inc. The modules will be integrated into Data Connectivity Modules (DCM-TCUs) or USB hosts (HUs) designed and produced by Continental or by a 3rd party for use by automotive OEMs. DCM-TCUs will be installed into vehicles during the OEM’s factory assembly process and will not be accessible without use of special tools.
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. » This radio transmitter (2807E-FE4CNX210) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
4 5 Antenna requirements for use with FE4CNX210 module: • • The FE4CNX210 module is for use with external antennas ONLY. For all standalone LTE/GSM operations the maximum antenna gain including cable loss shall not exceed the following values: o LTE Band 5: 10.0 dBi o LTE Band 12: 9.0 dBi o LTE Band 38: 9.0 dBi o LTE Band 41: 6.0 dBi o LTE Band 41 HPUE: 6.0 dBi • For all collocated LTE/GSM operations the maximum antenna gain including cable loss shall not exceed the following values: o LTE Band 5: 9.
5. Under no conditions may an antenna gain be used that would exceed the ERP and EIRP power limits as specified in Parts 15, 22H, 24E, and 27. 6. Clear instructions describing the other party’s responsibility to obtain station licensing. 6 Layout and Routing Recommendations 6.1 Module Specific The pad spacing of 0.7mm should allow the placement of a 450um finished VIA between pads, while maintaining a 125um via-to-trace or via-to-pad spacing, to facilitate the breakout of inner row signals. The 0.
Figure 2: NAD Pin Breakout The FE4CNX210 NAD should be oriented on the main board to minimize the length of the primary LTE TX/RX antenna (LTE_ANT_1). This 50ohm line should be as short as possible to the external RF connector or internal antenna feed point. The RF traces from the NAD antenna pins on the main board can be stripline or microstrip. For routing microstrip lines UNDERNEATH the NAD on layer 1, these ground cutouts internal to the NAD need to be accounted for in the stripline calculation.
Figure 3: Recommended PCB Stack-up Assume the main PCB above with a 6 layer stack up with ground cut away on layer 2 so the microstrip lines reference ground on layer 3. The dielectric thickness from L1 to L3 is 21.2 mils. Using an online impedance calculator, the line width under the NAD for a 50 ohm line is 15.9mils (405micron) shown below: Figure 4: Stripline Impedance Calculations The calculation for the microstrip line width outside the NAD is 37.
Figure 5: Microstrip Impedance Calculations Due to the nature of the weave chosen for each PCB, the dielectric constant of the NAD board is 4.1 while the main board is 4.3. A dielectric constant of 4.2 was chosen in the stripline calculation, while 4.3 was used for the microstrip calculation. Main board stack up may vary so these line widths may need to be recalculated. IT IS HIGHLY RECOMMENDED TO USE A SIMILAR STACKUP AS SHOWN IN FIGURE 3. Antenna Routing Recommendations: 1.
Figure 7: Antenna Line Stripline Routes On Inner Layer These line widths may vary depending on the stack up selected for the main board. 6.
