BL28NA-RD1 OEM Manual and User Guide v 3 (to be used for certification) FCC ID: LHJ-BL28NARD1 IC: 2807E-BL28NARD1 0
Terms and Acronyms • • • • • • • • • • • • • • • • • • • • • • • CDMA DCM DRX ES FDD GLONASS GNSS GPIO GSM HU HSIC LTE MP NAD OEM PCB PHY SIM TCU TDD TSP UMTS WCDMA Code Division Multiple Access Data Connectivity Module Discontinuous Reception Engineering Sample Frequency Division Duplex GLOBal’naya NAVigatsionnaya Sputnikovaya Sistema Global Navigation Satellite System General Purpose Input Output Global System for Mobile Head Unit High Speed Inter-Chip Long Term Evolution Mass Production Network Access
BL28NA-RD1 Module The BL28NA-RD1 NAD is a proprietary modem module designed by Continental Automotive Systems, Inc. The modem will be integrated into Data Connectivity Modules (DCMs) or Head Units (HUs) designed and produced by Continental or by a 3rd party for use by automotive OEMs. DCMs will be installed into vehicles during the OEM’s factory assembly process and will not be accessible without use of special tools.
non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.». 3 Device Installation and User Manual The BL28NA-RD1 module is a proprietary product designed and manufactured by Continental Automotive Systems, Inc. for integration into telematics control units manufactured by Continental Automotive Systems, Inc. for automotive OEMs. i.
• o LTE Band 5: 4.5 dBi o LTE Band 7: 9.0 dBi o LTE Band 12: 6.5 dBi o LTE Band 13: 6.5 dBi o For all collocated LTE/WCDMA/GSM operations the maximum antenna gain including cable loss shall not exceed the following values: o GSM 850: 2.0 dBi o GSM 1900: 2.5 dBi o WCDMA Band II: 2.5 dBi o WCDMA Band IV: 5.5 dBi o WCDMA Band V: 2.0 dBi o LTE Band 2: 2.5 dBi o LTE Band 4: 5.5 dBi o LTE Band 5: 2.0 dBi o LTE Band 7: 7.0 dBi o LTE Band 12: 3.5 dBi o LTE Band 13: 3.
Layout and Routing Recommendations 6.1 Module Specific The pad spacing of 1mm should allow the placement of a 600m finished VIA between pads, while maintaining a 200um Via- to-trace or Via-pad spacing, to facilitate the breakout of inner row signals. The 1mm spacing is also large enough to route two 200m (8 mil) traces between pads. Figure 6-1 Vias placed between Pads 6.2 RF Traces for antennas The NAD has three antenna pins.
Figure 6-2: NAD Pin Breakout The LTE CAT4 NAD should be oriented on the main board to minimize the length of the PRIMARY_LTE antenna pin (LTE Ant1). This 50ohm line should be as short as possible to the external RF connector or internal antenna feed point. The RF traces from the NAD antenna pins on the main board can be stripline or microstrip.
Figure 6-2: Antenna Pad Ground Cutout (Top View) For routing microstrip lines UNDERNEATH the NAD on layer 1, these ground cutouts internal to the NAD need to be accounted for in the stripline calculation. The internal GND height and dielectric constant of the NAD board are shown below: H = 19.3 mils (491 micron) Dielectric Constant = 4.
Using an online impedance calculator, the line width under the NAD for a 50 ohm line is 16.9mils (433micron) shown below: BL Figure 6-4 The calculation for the microstrip line width outside the NAD is 37.7mils (967micron) shown below: Figure 6-5 Due to the nature of the weave chosen for each PCB, the dielectric constant of the NAD board is 4.1 while the main board is 4.3. A dielectric constant of 4.2 was chosen in the stripline calculation, while 4.3 was used for the microstrip calculation.
The antenna traces need to routed STRAIGHT OUT OF THE NAD TO THE NEAREST NAD EDGE. The lines need to be tapered from 433micron to the 967micron width gradually but quickly. Figure 6-6 These line widths may vary depending on the stackup selected for the main board. 6.
