Data Sheet

HEF4049B_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 11 November 2008 7 of 11
NXP Semiconductors
HEF4049B
Hex inverting buffers
13. Package outline
Fig 7. Package outline SOT38-4 (DIP16)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT38-4
95-01-14
03-02-13
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
b
2
e
D
A
2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
0.764.2 0.51 3.2
inches
0.068
0.051
0.021
0.015
0.014
0.009
1.25
0.85
0.049
0.033
0.77
0.73
0.26
0.24
0.14
0.12
0.010.1 0.3
0.32
0.31
0.39
0.33
0.030.17 0.02 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4