Users Manual

ME910C1 HW User Guide
1VV0301351 Rev.13 Page 89 of 106 2020-06-30
Solder Reflow
Recommended solder reflow profile:
WARNING:
The above solder reflow profile represents the typical SAC reflow
limits and does not guarantee adequate adherence of the module to
the customer application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall
system taking into account such factors as thermal mass and
warpage..
Profile Feature Pb-Free Assembly Free
Average ramp-up rate (T
L
to T
P
) 3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds