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XTX / ETX COM Express

Qseven Technology congatec

Heatspreader

The speciﬁcations for Qseven

, COM Express

, XTX™ and

ETX

embedded computer modules include a heat-

spreader, which is a mechanical deﬁnition of the thermal

interface. All the heat generated by components such

as chipsets and processors is transferred to the system’s

cooling via the heatspreader. This can be achieved by

either a thermal connection to the casing, a heat pipe

or a heat sink.

Active and passive standard cooling solutions

Compared with sandwich-type constructions for heatspreaders and cooling

systems, active and passive cooling solutions remove one layer from the process.

The heatspreader and cooler are manufactured as one unit, which enables

them to provide faster thermal conduction. For an active cooling solution, a high

performance quiet fan has been integrated within the cooling ﬁns.

Thermal Stacks

The “thermal stacks” can also be used separately without a heatspreader. It is

distinguished from a heatspreader by its lack of a thermal conductive surface.

This also reduces differences in temperature.

New innovative heatspreader solution

congatec introduces a new heatspreader solution

that is optimized for vertically mounted applications.

All thermal stacks are ﬁxed in place through the use

of pins to ensure that there is no movement.

Features new gap pad material designed for less

seepage. Patented design.

Heatspreaders featuring Heatpipes

congatec introduces a new heatspreader solution

that features heatpipes. Designed speciﬁcally for the

latest generation of high performance multi core

processors.

The congatec solution features spring loaded ther-

mal stacks that provide o ptimized applied pressure

to the silicon dies. Patented design.

Passive cooling solution

Active cooling solution

Cooling Solutions

Heatspreader and passive cooling solution for Qseven.

NEW