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COM Express
®
XTX / ETXTools
www.congatec.com
congatecTechnologyQseven
New interfaces
COM Express
®
defines 440 interconnect pins
between the COM Express
®
module and the
carrier board. Legacy buses such as PCI, parallel
ATA and LPC are supported along with new serial
high speed interfaces such as PCI Express, Serial
ATA and Gigabit Ethernet.
Legacy Free
COM Express
®
is a legacy free standard. Outdated
interfaces such as floppy, PS/2 keyboard/mouse,
RS232, LPT are no longer supported. If required,
these legacy interfaces can be optionally
generated on the customized carrier board.
Size
COM Express
®
modules are available in three
different sizes: Compact, Basic and Extended.
The primary difference between the modules is
the overall physical size and the performance
envelope supported by each.
Thermal Design
As with XTX™ and ETX
®
, the COM Express
®
definition includes a heatspreader that acts as
a thermal interface between the COM Express
®
module and the system‘s cooling solution. All
heat generating components are thermally
conducted to the heatspreader in order to avoid
hot spots.
PCI Express
In addition to the 32 bit parallel PCI bus, COM
Express
®
offers up to 22 PCI Express™ lanes. This
allows the customer to equip their embedded
PC application with the next generation of PC
performance. PCI Express™ is a low pin count
interface with maximum bandwidth per pin.
The scalable bandwidth is max. 5 GBit/s per lane
and direction.
GPIO
COM Express
®
defines freely usable general
purpose inputs and outputs.
PCI Express Graphics (PEG)
The PEG interface utilizes up to 16 PCI Express
lanes in order to drive an external ultra high
performance graphic controller located on the
carrier board.
About PICMG
PICMG is a consortium of over 450 companies
who collaboratively develop open specifications
for high performance telecommunications and
industrial computing applications. The members
of the consortium have a long history of
developing leading edge products for these
industries.