English|2011
congatec is the preferred global vendor for innovative embedded solutions to enable competitive advantages for our customers. congatec AG congatec AG was founded in December 2004 and has since grown into a leading manufacturer of embedded computer modules with subsidiaries in Taiwan, USA and Czech Republic. The corporate mission of congatec is design, development, and worldwide marketing of industrial computer modules based on standard form factors.
PICMG - Executive member - COM Express design guide editor - COM Express Rev. 2.0 editor congatec Qseven® - Founding member - Specification & design guide editor XTX / ETX Intel® Channel Partner - Premier Intel® EA - Associate member COM Express® Qseven Technology congatec Technology Partnerships AMD® Embedded Solutions Partner XTX™ - Founding member - Specification & design guide editor Tools Microsoft® Embedded Partner 3 w w w.congatec.
The congatec rhythm is the driving force behind innovation and technology for embedded computer modules Economical Principal Software and Driver Support Our products and technologies offer innovative congatec offers advanced Board-Support- functionality of a standard BIOS allowing for Lifecycle Support Today it is obvious that product attention not solutions for industrial uses of embedded computer Packages, which include both the latest tested our products to be implemented into many only starts
congatec congatec AG International Technology Qseven COM Express® Solution Partner Tools Find more details at: www.congatec.com 55 XTX / ETX congatec Sales Partner w w w.congatec.
Computer - On - Modules - the Concept Embedded computer modules are highly integrated single board computers particularly suited for implementing customized solutions. Embedded computer modules are used when standard single board computers are not suitable for mechanical reasons or due to a lack of expandability. The difference between boards and modules Embedded computer modules are very small computer boards that can be integrated in almost every application without a cable connection.
congatec Time-to-market advantage - Lower engineering cost - Lower design risk COMs are flexible and can meet all performance requirements. The modules support a wide range of performance up to the Intel Core i7 processor, as well as future architectures. The COM standards are well established and are already prepared for the future. COMs put you in a leading position.
ACPI Battery Management In combination with an ACPI operating system, the battery functionality associated with mobile platforms is supported by congatec embedded computers. Now it‘s much easier to build mobile embedded applications that have notebook battery functionality. ACPI Battery Management The congatec ACPI BIOS and board controller are designed to support a CMB (Control Method Battery) sub-system.
congatec congatec Embedded BIOS Technology Embedded computer users usually require more than the standard functionality of an office computer. We at congatec have taken these requirements into account when designing our BIOS functionality.
Qseven® - the mobile COM definition Targeting next generation ultra mobile embedded processors built using 45 nm technology, the Qseven® format complements the low power and small size of these processors. By exploiting the small form factor of the industry`s latest processors, the Qseven® format offers high performance computing power, delivered in a module measuring only 70 x70 mm. Qseven® Interface PCi EXPRESS® ExpressCard™ ™ LPC SDVO 10 max. 4x x1 Lanes USB 2.
congatec Technology Qseven Connector Graphics Interfaces PCI Express Qseven® is unlike previous Computer-OnModules (COM) standards due to its primary focus being directed towards mobile and ultra mobile applications. It defines fast serial differential interfaces such as PCI Express and Serial ATA but omits support for legacy interfaces like EIDE and PCI in order to provide ideal support for today as well as future CPU's and chipsets.
Ultra Mobile - Qseven® NEW conga-QA6 Formfactor CPU DRAM Chipset Ethernet I/O Interface Serial ATA PCI Express USB 2.0 SDIO LPC Bus I²C Bus Additional Mass Storage Sound Graphics Video Interfaces congatec Board controller Embedded BIOS Feature Power Management Operating Systems Power Consumption Temperature Range Humidity 12 12 conga-QA Qseven Form Factor, 70 x 70 mm (23/4 x 23/4) Intel® AtomTM processor Z530, 1.6 GHz Intel® AtomTM E680T / E680, 1.6 GHz Intel® AtomTM E660T / E660, 1.
conga-QKIT Qseven ® mini carrier board This complete kit provides the abiility to start evaluating Full Feature Set. The conga-QMCB is a full featured, Qseven® modules immediately miniaturized carrier board for Qseven®.
Qseven® - Engineering Tools USB Touch BKLT Qseven Mobility Kit ® LED Backlight Module USB SATA LAN The congatec Qseven® mobility kit provides the ability to LVDS start evaluating Qseven® modules for all kind of mobile applications immediately.
congatec Qseven Technology Qseven® - Engineering Tools Evaluation Board for Qseven® modules. conga-SBM2Q is a complete battery manager sub-system To achieve a quick start with Qseven congatec offers an evaluation carrier in the form of a plug-in module. ® COM Express® conga-SBM 2Q conga-QEVAL board, which routes all the Qseven® signals to standard interface connectors. Gigabit Ethernet, 6x USB 2.
COM Express® - the Concept COM Express® is a PICMG standard that defines a Computer-On-Module, or COM, packaged as a super component. The defined interfaces provide a smooth transition path from legacy interfaces to LVDS (Low Voltage Differential Signaling) serial interfaces. This includes SDVO, PCI Express and Serial ATA.
congatec Technology Qseven Size PCI Express PCI Express Graphics (PEG) COM Express® defines 440 interconnect pins between the COM Express® module and the carrier board. Legacy buses such as PCI, parallel ATA and LPC are supported along with new serial high speed interfaces such as PCI Express, Serial ATA and Gigabit Ethernet. COM Express® modules are available in three different sizes: Compact, Basic and Extended.
COM Express® Basic - Product Overview NEW NEW conga-BM67 Formfactor CPU DRAM Chipset Ethernet I/O Interface Serial ATA PCI Express PEG USB Express Card® EIDE Sound Graphics Video Interface TV Out congatec Board controller Embedded BIOS Feature Security Power Management Operating Systems Power Consumption typ. Temperature Humidity 18 Intel® Core™ i7-2710QE (SV), 2.1 GHz Intel® Core™ i5 -2510E (SV), 2.
congatec Technology COM Express® Basic - Product Overview NEW Ethernet I/O Interface Serial ATA PCI Express PEG USB Express Card® EIDE Sound Graphics Video Interface max. 8 GByte DDR3 1067 MHz Intel® GS45 / ICH9ME-SFF Intel® GM45 / ICH9M-E, Intel® GL40 / ICH9M-E Intel® 82567LM Phy congatec Board controller Embedded BIOS Feature Security Power Management Operating Systems Power Consumption typ.
COM Express® Compact - Product Overview NEW Formfactor CPU DRAM Chipset Ethernet I/O Interface Serial ATA PCI Express PEG USB Express Card® EIDE Sound Graphics Video Interface congatec Board controller Embedded BIOS Feature Security Power Management Operating Systems Power Consumption typ. Temperature Humidity 20 conga-CS45 conga-CA945 conga-CA6 conga-CA Intel® Core™ 2 Duo SU9300, 1.2 GHz Intel® Core™ 2 Duo SL9400, 1.86 GHz Intel® Celeron® M ULV 722, 1.2 GHz Intel® Celeron® M ULV ULV 723, 1.
congatec Technology COM Express® - Engineering Tools 1x miniPCI Express Socket Evaluation Carrier Board for COM Express® modules. To achieve a quick start with COM Express® congatec offers an evaluation carrier board, which routes all the COM Express® signals to standard interface connectors. Supports COM Express® Compact and Basic modules using connector Pinout Type 2.
COM Express® - Engineering Tools conga-CKIT conga - SBM 2 C- Kit This complete kit provides the ability to start evaluating COM This battery manager kit can be operated in conjunction with the Express™ modules immediately. congatec COM Express® starter kit. When used together they provide a Contents: fast and simple way of evaluation all the features and configurations offered by the COM Express® and conga-SBM2C modules.
congatec conga-ADD2DP SMART Battery Manager Module conga-Cdebug Add2 Card for DisplayPort conga - SBM²C is a complete battery manager sub system COM Express® Debug Platform. The conga-Cdebug provides a implemented as a plug in module. This COM Express version debug platform for your application specific carrier board. Simply supports 12V power line. use it as a transparent debug interface between your carrier board The conga - ADD2DP provides two DisplayPort and the COM Express® module.
XTX™ - the Concept XTX™ is an expansion and continuation of the well established and highly successful ETX® standard. XTX™ offers the newest I/O technologies on this proven form factor. Now that the ISA bus is being used less and less in modern embedded applications, congatec offers different features on the X2 connector instead of the ISA bus currently found on the ETX® platform PCI Express guarantees longevity for XTX™.
congatec Technology Qseven ExpressCard™ Backwards Compatible to ETX® Upgrade to XTX™ In addition to the 32 bit parallel PCI bus, XTX™ offers 4 PCI Express™ lanes. This allows the customer to equip their embedded PC application with next generation of PC performance. PCI Express™ is a low pin count interface with maximum bandwidth per pin. The scalable bandwidth is 2.5 GBit/s per lane and direction. XTX™ supports up to two ExpressCard™ slots. ExpressCard™ is the successor to PCMCIA.
XTX™ - Product Overview NEW conga-XAF Formfactor CPU DRAM Chipset Ethernet I/O Interface Serial ATA PCI Express USB Express Card® EIDE Sound Graphics Video Interface TV Out congatec Board controller Embedded BIOS Feature Security Power Management Operating Systems Power Consumption typ. Temperature Humidity 26 Embedded G-Series Processors AMD T56N, 1.6 GHz AMD T48N, 1.4 GHz AMD T40N, 1.0 GHz AMD T52R, 1.5 GHz AMD T44R, 1.
This complete kit provides the ability to start evaluating XTX™ modules immediately. congatec conga-Xdebug conga-XDVI Evaluation Board for XTX™ modules. To achieve a XTX™ Debug Platform. The conga-Xdebug provides Evaluation Platform to convert SDVO quick start with XTX™ congatec offers an evaluation a debug platform for your application specific to DVI-D. The conga-XDVI provides the carrier board, which routes all the XTX™ signals to carrier board.
XTX™ - Engineering Tools SMART Battery Manager Module conga-SBM 2-Kit conga-SBM2 is a complete battery manager conjunction with the congatec XTX™ starter sub-system in the form of a plug-in module. Support 2S1P up to 4S3P, parallel or sequential battery operation This battery manager kit can be operated in kit. When used together they provide a fast and simple way of evaluating all the functionalities and configurations offered by the XTX™ and SBM2 modules.
congatec Technology ETX® - Product Overview NEW Chipset Ethernet I/O Interface SATA EIDE IDE USB Compact Flash® PCI Bus Sound Graphics Video Interface TV Out congatec Board controller Embedded BIOS Feature Power Management Operating Systems Power Consumption typ. Temperature Humidity Qseven ETX® Spec 2.7, 95 x 114 mm (3.7“ x 4.5“) AMD Geode™ LX 800, 500 MHz conga-EVAL Evaluation Board for ETX® modules. To achieve a quick start with up to 1 Gbyte DDR333 Onboard 256 GB AMD Geode™ CS5536 IEEE 802.
Engineering Tools for all Modules conga-FPA2 conga-LDVI conga-FPA2 is a universal flat panel adapter board that has DVI Converter Module for LVDS been designed to be EPI (Embedded Panel Interface) compliant. It can be used for either prototyping, demonstration purposes, or Compact module to convert LVDS to DVI-D. It can be used with either COM Express®, Qseven® , XTX™ or ETX® modules. It`s now possible to realize a dual port DVI-D system independent of the typical Video Output Ports (SDVO or DVO).
congatec Technology Cooling Solutions New innovative heatspreader solution Heatspreader Active and passive standard cooling solutions congatec introduces a new heatspreader solution that is optimized for vertically mounted applications. All thermal stacks are fixed in place through the use of pins to ensure that there is no movement. Features new gap pad material designed for less seepage. Patented design.
Subsidiaries: congatec AG congatec Asia Ltd. congatec, Inc. congatec s.r.o. Auwiesenstraße 5 94469 Deggendorf, Germany Phone +49 (991) 2700-0 Fax +49 (991) 2700 -111 info@congatec.com www.congatec.de 12F-5, No. 270, Sec 4, Zhongxiao E. Rd. 106 Taipei City, Taiwan Phone +886 2 2775 4645 Fax +886 2 2775 3263 sales-asia@congatec.com www.congatec.tw 6262 Ferris Square San Diego CA 92121 USA Phone +1 858-457-2600 Fax +1 858-457-2602 sales-us@congatec.com www.congatec.
