User guide
Table Of Contents
- HP ProLiant ML330 G6 Server User Guide
- Abstract
- Notice
- Contents
- Component identification
- Operations
- Setup
- Hardware options installation
- Introduction
- Processor option
- Memory options
- Redundant hot-plug power supply option
- Redundant fan assembly option
- SAS or SATA hard drive option
- Expansion hard drive cage option (hot-plug)
- Expansion hard drive cage option (non-hot-plug)
- Removable media devices
- Expansion board options
- PCI-X extender board option
- Storage controller option
- Battery-backed write cache battery pack option
- FBWC module and capacitor pack option
- SAS controller option
- Dedicated iLO 2 port module option
- HP Trusted Platform Module option
- Cabling
- Configuration and utilities
- Troubleshooting
- Battery replacement
- Regulatory compliance notices
- Regulatory compliance identification numbers
- Federal Communications Commission notice
- Declaration of conformity for products marked with the FCC logo, United States only
- Modifications
- Cables
- Canadian notice (Avis Canadien)
- European Union regulatory notice
- Disposal of waste equipment by users in private households in the European Union
- Japanese notice
- BSMI notice
- Korean notice
- Chinese notice
- Laser compliance
- Battery replacement notice
- Taiwan battery recycling notice
- Power cord statement for Japan
- Electrostatic discharge
- Specifications
- Technical support
- Acronyms and abbreviations
- Index
Hardware options installation 44
• Populate DIMM slots for a processor only if the processor is installed.
• To maximize performance in multi-processor configurations, distribute the total memory capacity
between all processors as evenly as possible.
• Do not mix Unbuffered and Registered PC3 DIMMs.
• Each channel supports up to two Unbuffered DIMMs.
• If quad-rank DIMMs are installed for a processor, a maximum of two DIMMs can be installed on each
channel for that processor.
• If a channel contains quad-rank DIMMs, the quad-rank DIMM must be installed first on that channel.
DIMM speeds are supported as indicated in the following table.
Populated slots
(per channel)
Rank Speeds supported
(MHz)
1
Single- or dual-rank 1333, 1066
1
Quad-rank 1066
2
Single- or dual-rank 1066
3
Single- or dual-rank 800
Advanced ECC population guidelines
For Advanced ECC mode configurations, observe the following guidelines:
• Observe the general DIMM slot population guidelines (on page 43).
• DIMMs may be installed individually.
Single-processor Advanced ECC population order
For Advanced ECC mode configurations with a single processor, populate the DIMM slots in the following
order:
• RDIMM: Sequentially in alphabetical order (A through I)
• UDIMM: A through F, sequentially in alphabetical order. Do not populate DIMM slots G through I.
Multi-processor Advanced ECC population order
For Advanced ECC mode configurations with multiple processors, populate the DIMM slots for each
processor in the following order:
• RDIMM: Sequentially in alphabetical order (A through I)
• UDIMM: A through F, sequentially in alphabetical order. Do not populate DIMM slots G through I.
Lockstep Memory population guidelines
For Lockstep memory mode configurations, observe the following guidelines:
• Observe the general DIMM slot population guidelines (on page 43).
• Always install DIMMs in channels 1 and 2 for each installed processor.
• Do not install DIMMs in channel 3 for any processor.
• DIMM configuration on channel 1 and channel 2 of a processor must be identical.