HP ProLiant DL388p Gen8 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
© Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft®, Windows®, and Windows Server® are U.S.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................................................................................ 6 Illustrated parts catalog ............................................................................................................... 16 Mechanical components ..........................................
Heatsink .................................................................................................................................................... 58 Processor................................................................................................................................................... 60 DIMMs ...................................................................................................................................................... 64 System battery ................
HP 1200W Common Slot 277VAC Hot Plug Power Supply (94% efficiency) ....................................... 100 HP 1200W Common Slot 380VDC Hot Plug Power Supply (94% efficiency)........................................ 100 HP 1200W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) .................................. 101 Acronyms and abbreviations ...................................................................................................... 102 Documentation feedback ...................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 6) 1 Access panel 681651-001 Mandatory1 2 Fan cage 662518-001 Mandatory1 3 SFF hard drive cage, 8 bay, with backplane 670943-001 Optional2 4 SFF front panel assembly — — 5 a) 8 bay, with cables, left and right ears, no 675602-001 backplane b) 25 bay, with cables, left and right ears, with 696958-001 backplane* LFF front panel assembly — Optional2 Optional2 — Illustrated pa
Item Description Optional2 6 a) 8 bay, with cables, left and right ears, with 675603-001 backplane b) 12 bay, with cables, left and right ears, with 670944-001 backplane* PCI riser cage — a) PCI riser cage, standard 662526-001 Mandatory1 b) PCI riser cage, double-wide* 709860-001 Mandatory1 c) PCI riser cage, NEBS* 709859-001 Mandatory1 7 Air baffle 662527-001 Mandatory1 8 Hard drive blank* — — a) Hard drive blank, SFF 667276-001 Mandatory1 b) Hard drive blank, LFF 667279-001 Manda
Item Description Spare part number Customer self repair (on page 6) the friction rail kit)* * Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". 3 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
System components Item Description Spare part number Customer self repair (on page 6) System components 22 Hot-plug fan 662520-001 Mandatory1 23 Power supplies, hot-plug — — a) 460 W, 92% 511777-001 Mandatory1 b) 460 W, Platinum Plus, 94%* 660184-001 Mandatory1 c) 500 W, 94%* 638549-001 Mandatory1 d) 750 W, 94%* 674890-001 Mandatory1 e) 750 W, Titanium, 96%* 700287-001 Mandatory1 f) 750 W, 92%* 511778-001 Mandatory1 g) 750 W, Platinum Plus, 94%* 660183-001 Mandatory1 h) 750
Item Description Spare part number Customer self repair (on page 6) 25 Riser boards — — a) PCIe riser board, standard 3-slot 662524-001 Optional2 b) PCIe riser board, optional 2-slot* 662525-001 Optional2 26 Power supply backplane 662528-001 Mandatory1 27 662515-001 Optional2 662516-001 Optional2 29 Systems Insight Display subassembly, LFF, with cables Systems Insight Display subassembly, SFF, with cables* HP Trusted Platform Module* 505836-001 No3 30 FlexibleLOM — — a) HP 1Gb
Item 32 33 Description Spare part number Customer self repair (on page 6) t) 16-GB, PC3-12800R-11, dual-rank x4* 684031-001 Mandatory1 u) 16-GB, PC3L-10600R-9, dual-rank x4* 664692-001 Mandatory1 v) 16-GB, PC3-14900R, quad-rank x4* 715274-001 Mandatory1 w) 16-GB, PC3L-12800R, quad-rank x4* 715284-001 Mandatory1 x) 16-GB 2Rx4 PC3-10600H-9 HC FIO kit* 684032-001 Mandatory1 y) 24-GB, PC3L-12800R, quad-rank x4* 718689-001 Mandatory1 z) 32-GB, PC3L-10600L-9, quad-rank x4* 664693-001 Man
Item 34 35 36 Description Spare part number Customer self repair (on page 6) e) 500-GB, 7,200-rpm, SFF, 6G* 656107-001 Mandatory1 f) 1-TB, 7,200-rpm, SFF, 6G* 656108-001 Mandatory1 Hot-plug SAS* — — a) 2-TB, 7,200-rpm, LFF, 6G, dual port 653948-001 Mandatory1 b) 3-TB, 7,200-rpm, LFF, 6G, dual port 653959-001 Mandatory1 c) 300-GB, 10,000-rpm, SFF, 6G, dual port 653955-001 Mandatory1 d) 450-GB, 10,000-rpm, SFF, 6G, dual port 653956-001 Mandatory1 e) 600-GB, 10,000-rpm, SFF, 6G, dua
Item Description Spare part number Customer self repair (on page 6) 42 8 or 16 SFF ribbon Mini-SAS storage cable* 675610-001 Mandatory1 43 Miscellaneous cable kit* 725768-001 Mandatory1 a) 25 SFF Mini-SAS SR cable — — b) 12 LFF Mini-SAS SR cable — — c) 12 LFF/25 SFF power cable — — 675611-001 Mandatory1 45 8 or 16 SFF Mini-SAS hard drive backplane to storage card* 8 LFF drive cage data cable* 733716-001 Mandatory1 46 12 LFF drive cage data cable* 733717-001 Mandatory1 47 25 S
Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
Illustrated parts catalog 26
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (included with the server) • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 78) Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 28).
• Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode. This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown. • Use a virtual power button selection through HP iLO. This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.
Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: 1. Power down the server (on page 27). 2. Extend the server from the rack (on page 28). 3. Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option. 4. Place the server on a sturdy, level surface.
2. After the display fully ejects, rotate the display downward to view the LEDs. Access the product rear panel Opening the cable management arm IMPORTANT: The cable management arm is not supported with the friction rail kit. To access the server rear panel: 1. Release the cable management arm.
2. Open the cable management arm. Note that the cable management arm can be right-mounted or left-mounted. Release the full-length expansion board retainer To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 28) or remove ("Remove the server from the rack" on page 29) the server from the rack. 4.
To replace the component, reverse the removal procedure. Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power. WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power from the system. Server warnings and cautions Before installing a server, be sure that you understand the following warnings and cautions. WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug.
Air baffle CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
2U rack bezel To remove the component: Unlock the 2U rack bezel, press the latch on the 2U rack bezel, and then remove the 2U rack bezel. To replace the component, reverse the removal procedure. PCIe riser blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a.
5. Remove the PCIe riser blank. To replace the component, reverse the removal procedure. PCIe riser cage (primary) WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. To remove the component: 1. Power down the server (on page 27).
8. Remove the PCIe riser cage. To replace the component, reverse the removal procedure. PCIe riser cage (secondary) WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. To remove the component: 1. Power down the server (on page 27).
8. Remove the secondary PCIe riser cage. To replace the component, reverse the removal procedure. PCIe riser board To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 28) or remove ("Remove the server from the rack" on page 29) the server from the rack. 4. Remove the access panel ("Access panel" on page 33). 5.
8. Remove the PCIe riser board. To replace the component, reverse the removal procedure. Drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the drive blank. To replace the component, slide the component into the bay until it clicks. Hot-plug drive CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.
3. Remove the drive. To replace the component, reverse the removal procedure. Power supply blank Remove the blank. To replace the component, reverse the removal procedure. AC power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. To replace the component, reverse the removal procedure. Optical drive To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
7. Disconnect the optical drive cable. 8. Remove the optical drive.
9. Remove the optical drive bracket, for use with the replacement optical drive. 10. Before replacing the component, install the optical drive bracket, retained from the optical drive you are replacing. To replace the component, reverse the removal procedure.
Power supply backplane To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove all power supplies ("AC power supply" on page 40). 4. Extend ("Extend the server from the rack" on page 28) or remove ("Remove the server from the rack" on page 29) the server from the rack. 5. Remove the access panel ("Access panel" on page 33). 6. Disconnect the SATA cable. 7.
To replace the component, reverse the removal procedure. Hot-plug fan The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server. The server shuts down in the following temperature-related scenarios: • At POST: o The BIOS suspends the server for 5 minutes if it detects a cautionary temperature level.
3. Remove the fan. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To replace the component, reverse the removal procedure. Fan cage To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
6. Remove the fan cage. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. IMPORTANT: For optimum cooling, install fans in all primary fan locations. For more information, refer to the fan locations table ("Hot-plug fans" on page 93). To replace the component, reverse the removal procedure.
Pull the FlexibleLOM toward the front of the server while removing it, to avoid catching it on the rear chassis. To replace the component: 1. Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew. 2. Install the PCIe riser cage ("PCIe riser cage (primary)" on page 36). 3. Install the access panel ("Access panel" on page 33). 4. Slide the server into the rack. 5. Connect the LAN segment cables. 6. Connect each power cord to the server. 7.
SFF hard drive cage To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 28) or remove ("Remove the server from the rack" on page 29) the server from the rack. 4. Remove the access panel ("Access panel" on page 33). 5. Remove all hot-plug hard drives ("Hot-plug drive" on page 39). 6.
5. Remove the air baffle ("Air baffle" on page 34). 6. Remove the fan cage ("Fan cage" on page 46). 7. Remove the Systems Insight Display: a. Remove the screw from the rear of the Systems Insight Display. b. Disconnect the Systems Insight Display cable and the USB cable from the system board, and disconnect the USB cable from the front of the Systems Insight Display. c. Remove the Systems Insight Display. To replace the component, reverse the removal procedure.
5. Remove the serial label pull tab, and retain it for the new front panel assembly. 6. Remove the air baffle ("Air baffle" on page 34). 7. Remove all drives ("Hot-plug drive" on page 39). 8. If installed, remove the optical drive ("Optical drive" on page 41). 9. Remove the fan cage ("Fan cage" on page 46). 10. Disconnect all cables from the front panel assembly. IMPORTANT: If any cables in the front panel assembly need replacing, the entire front panel assembly must be replaced. 11.
Flash-backed write cache procedures Two types of procedures are provided for the FBWC option: • • Removal and replacement of failed components: o Removing the cache module ("Flash-backed write cache module" on page 52) o Removing the capacitor pack ("Flash-backed write cache capacitor pack" on page 53) Recovery of cached data from a failed server ("Recovering data from the flash-backed write cache" on page 55) CAUTION: Do not detach the cable that connects the battery pack or capacitor pack to the ca
9. Open the ejector latches on each side of the cache module connector. Normally, the cache module is ejected from the cache module connector. If the module is not ejected automatically, remove the cache module. 10. If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the connector on the top of the cache module. To replace the component, reverse the removal procedure.
2. Close all applications. 3. Power down the server (on page 27). 4. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. 5.
10. Remove the capacitor pack (SFF shown). To replace the component, reverse the removal procedure. Recovering data from the flash-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the FBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 32). 1. Perform one of the following: o Set up a recovery server using an identical server model.
Expansion slot blanks WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b.
a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 28) or remove ("Remove the server from the rack" on page 29) the server from the rack. 4. Remove the access panel ("Access panel" on page 33). 5. Disconnect any external cables that are connected to the expansion board. 6. Disconnect any internal cables that are connected to the expansion board. 7.
4. Remove the access panel ("Access panel" on page 33). 5. Remove the air baffle ("Air baffle" on page 34). 6. Remove the heatsink. To replace the component: 1. Remove the thermal interface protective cover from the heatsink.
2. Install the heatsink. 3. Install the air baffle ("Air baffle" on page 34). 4. Install the access panel ("Access panel" on page 33). 5. Slide the server into the rack. 6. Connect each power cord to the server. 7. Connect each power cord to the power source. 8. Power up the server. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. To remove the processor: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 28) or remove ("Remove the server from the rack" on page 29) the server from the rack. 4. Remove the access panel ("Access panel" on page 33). 5.
8. Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. To replace the component: 1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. 2. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. CAUTION: Do not press down on the processor.
6. Install the heatsink. 7. Install the air baffle ("Air baffle" on page 34). 8. Install the access panel ("Access panel" on page 33). 9. Slide the server into the rack. 10. Connect each power cord to the server. 11. Connect each power cord to the power source. 12. Power up the server. DIMMs IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix these two types causes the server to halt during BIOS initialization.
5. Remove the air baffle ("Air baffle" on page 34). 6. Remove the DIMM. To replace the component, reverse the removal procedure. For DIMM configuration information, see the server user guide. System battery If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
7. Remove the battery. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. System board To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the server from the rack (on page 29). 4.
16. Remove the heatsink ("Heatsink" on page 58). 17. Remove the processor ("Processor" on page 60). 18. Remove left and right fan cage brackets. 19. Loosen the system board thumbscrews. 20. Remove the system board, using the handle to lift it out of the chassis.
To replace the component: 1. Install the spare system board. 2. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
3. Remove the clear processor socket cover. Retain the processor socket cover for future use. 4. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 6. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 7. Install the processor socket cover onto the processor socket of the failed system board. 8.
10. Install the heatsink. IMPORTANT: Install all components with the same configuration that was used on the failed system board. 11. Install all components removed from the failed system board. 12. Install the access panel ("Access panel" on page 33). 13. Install the power supplies ("AC power supply" on page 40). 14. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID. 1.
Warning: The Product ID should ONLY be modified by qualified personnel. This value should always match the Product ID on the chassis. 8. Enter the product ID and press the Enter key. 9. Press the Esc key to close the menu. 10. Press the Esc key to exit RBSU. 11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.
7. Disconnect the Chipset SATA cable from the system board and the hard drive backplane and remove from the cable guide. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.
Cabling SAS hard drive cabling • SFF hard drive cabling • SFF cabling, with optional drive cage Cabling 74
• LFF hard drive cabling Optical drive cabling Cabling 75
FBWC cabling • 8 or 16 drive SFF • 8 drive LFF • PCIe option Cabling 76
Depending on the server configuration, you may need to remove the primary PCI riser cage ("PCIe riser cage (primary)" on page 36) before cabling to a PCIe expansion board.
Diagnostic tools Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 78) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos).
USB support and functionality USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM. Legacy USB support provides USB functionality in environments where USB support is not available normally.
Component identification Front panel components • SFF model Item Description 1 Video connector 2 SATA optical drive bay 3 Drive bays 4 Systems Insight Display 5 USB connectors (2) • Item SFF model with optional hard drive cage Description 1 Video connector 2 Drive bays (box 1) 3 Drive bays (box 2) 4 Systems Insight Display 5 USB connectors (2) Component identification 81
• LFF model Item Description 1 Video connector 2 SATA optical drive bay 3 Drive bays 4 Systems Insight Display 5 USB connectors (2) Front panel LEDs and buttons Item Description Status 1 Aggregate network LED Off = No network link Solid green = Link to network Flashing green = Network activity 2 System health LED Solid Green = Normal Flashing Amber = System degraded Flashing Red = System critical To identify components in degraded or critical state, see "Systems Insight Display LEDs (
Item Description Status 3 UID LED and button Off = Deactivated Solid Blue = Activated Flashing Blue = System being remotely managed 4 Power On/Standby button and system power LED Off = Power cord not attached or power supply failure Solid Amber = System is in standby; Power On/Standby Button service is initialized. Flashing Green = Power On/Standby Button has been pressed; system is waiting to power on.
Item Description Status 3 AMP status Off = AMP modes disabled Solid green = AMP mode enabled Solid amber = Failover Flashing amber = Invalid configuration 4 Over temp Off = Normal Solid amber = High system temperature detected — All other LEDs Off = Normal Amber = Failure For more information on the activation of these LEDs, see "Systems Insight Display LED combinations (on page 84).
Systems Insight Display Health LED LED and color Power supply (amber) Amber System power LED Status Green • • • • Redundant power supply is installed and only one power supply is functional. AC power cord is not plugged into redundant power supply. Redundant power supply fault Power supply mismatch at POST or power supply mismatch through hot-plug addition.
Rear panel LEDs and buttons Item Description Status 1 UID LED/button Off = Deactivated Solid blue = Activated Flashing blue = System being managed remotely 2 Power supply 2 LED Off = System is off or power supply has failed. Solid green = Normal 3 Power supply 1 LED Off = System is off or power supply has failed.
*The server ships with one PCIe3 riser cage installed in the primary riser cage connector. †PCIe slot 3 is connected to the southbridge and runs at the Gen2 signaling rate. Notes: • "Primary" denotes the riser cage is installed in the primary riser connector. • "Secondary" denotes the riser cage is installed in the secondary riser connector.
Item Description 2 Systems Insight Display connector 3 Fan connector 5 4 Processor 1 DIMM slots 5 Fan connector 4 6 Front I/O connector 7 Front USB connector 8 Fan connector 3 9 First drive cage, box 2 power connector 10 Fan connector 2 11 Processor 2 DIMM slots 12 Second drive cage, box 1 power connector 13 Fan connector 1 14 Discovery services connector 15 Front video connector 16 USB connector 17 Power supply backplane connector 18 SATA optical drive connector 19 NMI
Position Default Function S6 Off Off = No function On = ROM reads system configuration as invalid. S7 — Reserved S8 — Reserved S9 — Reserved S10 — Reserved S11 — Reserved S12 — Reserved To access the redundant ROM, set S1, S5, and S6 to on. When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM. CAUTION: Clearing CMOS and/or NVRAM deletes configuration information.
DIMM slot locations DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the letter assignments for population guidelines.
• LFF device bay numbering Hot-plug drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail.
Status On = AC power is connected. Off = AC power is disconnected. FBWC module LEDs (P222, P420, P421) The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing. 1 - Amber 2 - Green 3 - Green Interpretation Off Off Off The cache module is not powered. Off Flashing 0.5 Hz Flashing 0.
1 - Amber 2 - Green 3 - Green Interpretation Off Off On The cache module is idle, and the capacitor pack is charged. Off On On The cache module is idle, the capacitor pack is charged, and the cache contains data that has not yet been written to the drives. Off Flashing 1 Hz Off A backup is in progress. Off On Off The current backup is complete with no errors. Flashing 1 Hz Flashing 1 Hz Off The current backup failed, and data has been lost.
For a single-processor configuration, four fans and two blanks are required in specific fan bays for redundancy. A fan failure or missing fan causes a loss of redundancy. A second fan failure or missing fan causes an orderly shutdown of the server. Installing more than the required number of fans in a single-processor configuration is not a supported configuration. For a dual-processor configuration, six fans are required for redundancy. A fan failure or missing fan causes a loss of redundancy.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -30°C to 50°C (-22°F to 122°F) Storage -30°C to 60°C (-22°F to 140°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
• HP 750W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) (on page 99) • HP 750W Common Slot -48VDC Hot Plug Power Supply (94% efficiency) (on page 99) • HP 1200W Common Slot 277VAC Hot Plug Power Supply (94% efficiency) (on page 100) • HP 1200W Common Slot 380VDC Hot Plug Power Supply (94% efficiency) (on page 100) • HP 1200W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) (on page 101) For detailed power supply specifications, see the server QuickSpecs on the HP
Power supply output Rated steady-state power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input Maximum peak power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input HP 500W Common Slot 277VAC Hot Plug Power Supply (94% efficiency) Specification Value Input requirements — Rated input voltage 200 V to 277 V AC Rated input frequency 50 Hz–60 Hz Rated input current 3.0 A at 200 V AC 2.
HP 750W Common Slot Titanium Hot Plug Power Supply (96% efficiency) Specification Value Input requirements — Rated input voltage 200 to 240 V AC Rated input frequency 50 Hz to 60 Hz Rated input current 4.0 A at 200 V AC 3.
HP 750W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) Specification Value Input requirements Rated input voltage 100 to 120 VAC, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 8.5 A at 100 VAC 4.
If this connection is made, all of the following must be met: • This equipment must be connected directly to the DC supply system earthing electrode conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply system earthing electrode conductor is connected.
Rated input current 5.6 A at 240 V DC 3.
Acronyms and abbreviations ASR Automatic Server Recovery DDR double data rate FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log NMI nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA Acronyms and abbreviations 102
TPM Trusted Platform Module UID unit identification USB universal serial bus Acronyms and abbreviations 103
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Index A AC power supply 40, 96, 97, 98, 99, 100, 101 access panel 33 air baffle 34 B battery 65 buttons 27, 81 C cable management arm 30 cables 74 cabling 74, 75 cautions 33 components 16, 81 components, identification 16, 81 connectors 81 CSR (customer self repair) 6 customer self repair (CSR) 6 D diagnostic tools 78 diagnostics utility 78 DIMM slot locations 90 DIMMs 64, 90 drive LEDs 91 drives 39, 91 E electrostatic discharge 32 environmental specifications 95 error messages 78 expansion boards 56, 5
P part numbers 16 POST error messages 78 power supply 40 power supply LEDs 86 power supply specifications 95, 96, 98, 99, 100, 101 powering down 27 preparation procedures 27 processors 60 USB support 80 utilities 78 utilities, deployment 79 V video connector 81 W warnings 33 R RBSU (ROM-Based Setup Utility) 79 rear panel buttons 86 rear panel components 85 rear panel LEDs 86 rear panel, accessing 30 removal and replacement procedures 27 removing server from rack 29 S safety considerations 32 SAS and SA
