HP ProLiant DL388 G7 Server Maintenance and Service Guide Abstract This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
© Copyright 2010, 2011 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are U.S.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................................................................................ 6 Illustrated parts catalog ............................................................................................................... 17 Mechanical components ..........................................
Expansion boards ...................................................................................................................................... 57 Half-length expansion board ............................................................................................................. 57 Full-length expansion board............................................................................................................... 58 Heatsink .................................................................
Index .......................................................................................................................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Customer self repair 16
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 6) 1 Access panel 610525-001 Mandatory1 2 Power supply cage 496063-001 Mandatory1 3 Fan cage 496067-001 Mandatory1 4 Optical drive cage 496076-001 Mandatory1 5 SFF hard drive cage 496074-001 Mandatory1 6 PCI riser cage 614778-001 Mandatory1 7 Air baffle 599039-001 Mandatory1 8 Bezel kit 496080-001 Mandatory1 a) Right bezel — — b) Left bezel — — 9 LFF ha
Item Description Spare part number Customer self repair (on page 6) 468290-001 Optional2 13 b) Thermal kit (cleaning pad and thermal grease) Hardware kit* 496058-001 Mandatory1 a) Optical device blank — — b) Fan blank — — c) Full-length expansion slot cover — — d) Low-profile expansion slot cover — — e) PCI retainer — — f) PCI top retainer — — g) PCI end retainer — — h) PCI removable retainer — — * Not shown 1 Mandatory—Parts for which customer self repair is mandatory.
Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario.
System components Item Description Spare part number Customer self repair (on page 6) System components Illustrated parts catalog 20
Item Description Spare part number Customer self repair (on page 6) 14 Hot-plug fan, 60-mm 496066-001 Mandatory1 15 Power supplies, hot-plug — — a) 460-W, AC 511777-001 Mandatory1 b) 750-W, AC* 511778-001 Mandatory1 c) 1200-W, -48VDC* 451816-001 Mandatory1 d) 450-W HE 94%* 599381-001 Mandatory1 e) 750-W HE 94%* 599383-001 Mandatory1 f) 1200-W HE 94%* 579229-001 Mandatory1 Boards 16 System board assembly 599038-001 Optional2 17 Riser boards — — a) PCI riser board 496057
Item 28 Description Spare part number Customer self repair (on page 6) c) PC3L-10600R, 4-GB 606426-001 Mandatory1 d) PC3L-10600R, 8-GB 606427-001 Mandatory1 — — a) 2.13-GHz Intel® Xeon® processor L5630 594891-001 Optional2 b) 2.13-GHz Intel® Xeon® processor E5506 506013-001 Optional2 c) 2.26-GHz Intel® Xeon® processor L5640 594890-001 Optional2 d) 2.40-GHz Intel® Xeon® processor E5620 594887-001 Optional2 e) 2.53-GHz Intel® Xeon® processor E5630 594886-001 Optional2 f) 2.
Item 31 32 Description Spare part number Customer self repair (on page 6) b) 250-GB, 5,400-rpm, 1-year warranty 460426-001 Mandatory1 Hot-plug LFF SAS* — — a) 72-GB, 15,000-rpm, dual-port 389343-001 Mandatory1 b) 146-GB, 15,000-rpm, dual-port 488058-001 Mandatory1 c) 300-GB, 15,000-rpm, dual-port, enterprise 488060-001 Mandatory1 d) 400-GB, 10,000-rpm, dual-port 456896-001 Mandatory1 e) 450-GB,15,000-rpm, dual-port 454274-001 Mandatory1 f) 750-GB, 7200-rpm, dual-port, 1-year warra
Item Description Spare part number Customer self repair (on page 6) 505908-001 Mandatory1 Controller option 49 FBWC module, with 1-GB cable *Not shown **If LVDIMMs are mixed with standard DDR3 DIMMs on the same server, the LVDIMMs operate at 1.5V. LVDIMMs are only supported for use with the Intel® Xeon® 5600 series of processors. †All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption.
Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (included with the server) • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 84) Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 27).
NOTE: If the operating system automatically places the server in Standby mode, omit the next step. 3. Press the Power On/Standby button to place the server in Standby mode. When the server activates Standby power mode, the system power LED changes to amber. IMPORTANT: Pressing the UID button illuminates the blue UID LEDs on the front and rear panels. In a rack environment, this feature facilitates locating a server when moving between the front and rear of the rack. 4. Disconnect the power cords.
Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 27). 3. Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option. 4. Place the server on a sturdy, level surface.
1. Remove the cable arm retainer. 2. Open the cable management arm. Cable management arm with right-hand swing NOTE: To access some components, you may need to remove the cable management arm. To access the product rear panel components, open the cable management arm: 1. Power down the server (on page 26). 2. Swing open the cable management arm. 3. Remove the cables from the cable trough.
4. Remove the cable management arm. Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
WARNING: To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug. The grounding plug is an important safety feature. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. • Unplug the power cord from the power supply to disconnect power to the equipment. • Do not route the power cord where it can be walked on or pinched by items placed against it.
Air baffle To remove the component: CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31).
o If no full-length expansion boards are installed, remove the full-length expansion board shipping bracket as indicated. o If full-length expansion boards are installed, remove the full-length expansion board shipping bracket as indicated. To replace the component, reverse the removal procedure. PCI riser cage To remove the component: CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage. 1.
2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. If any full-length expansion boards are installed, remove the full-length expansion board shipping bracket ("Full-length expansion board shipping bracket" on page 32). 5. Remove the PCI riser cage. To replace the component, reverse the removal procedure.
CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED combinations" on page 99). 2. Back up all server data on the hard drive. 3. Remove the hard drive.
To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1.
NOTE: If using the power cord anchor, be sure to leave enough slack in the power cord so that the redundant power supply can be removed without disconnecting the power cord from the primary power supply. 5. Close the cable management arm. 6. Connect the power cord to the power source. 7. Be sure that the power supply LED is green ("Rear panel LEDs and buttons" on page 92). 8. Be sure that the power supply LED on the SID is green ("Systems Insight Display LEDs" on page 89).
5. Remove the optical drive. To replace the component, reverse the removal procedure. Optical drive cage To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3.
5. Remove the optical drive ("Optical drive" on page 37). 6. Remove the optical drive cage. To replace the component, reverse the removal procedure. Power supply backplane To remove the component: 1. Power down the server (on page 26). 2. Remove all power supplies ("Hot-plug power supply" on page 36). 3. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 4. Remove the access panel ("Access panel" on page 31).
To replace the component, reverse the removal procedure. Hot-plug fan The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server. The server shuts down in the following temperature-related scenarios: • At POST: o The BIOS suspends the server for 5 minutes if it detects a cautionary temperature level.
3. Remove the fan. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To replace the component, reverse the removal procedure. SFF hard drive backplane To remove the component: 1. Power down the server (on page 26). 2.
5. Disconnect all cables from the hard drive backplane. 6. Remove the hard drive backplane. To replace the component, reverse the removal procedure. SFF hard drive cage To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4.
6. Remove the hard drive backplane ("SFF hard drive backplane" on page 41). 7. Remove the hard drive cage. To replace the component, reverse the removal procedure. LFF hard drive backplane To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4.
6. Remove the hard drive backplane. To replace the component, reverse the removal procedure. LFF hard drive cage To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. Remove all hot-plug hard drives ("Hot-plug SAS hard drive" on page 34). 5.
7. Remove the hard drive cage. To replace the component, reverse the removal procedure. Systems Insight Display To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the PCI riser cage ("PCI riser cage" on page 33). 5. Remove the air baffle ("Air baffle" on page 32). 6. Disconnect the Systems Insight Display cable. 7. Remove the Systems Insight Display.
To replace the component, reverse the removal procedure. Front left bezel To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the PCI riser cage ("PCI riser cage" on page 33). 5. Remove the air baffle ("Air baffle" on page 32). 6.
2. Remove the three T-10 Torx screws, and then detach the front bezel. To replace the component, reverse the removal procedure. Fan cage To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. Remove the PCI riser cage ("PCI riser cage" on page 33). 5.
7. Remove the fans ("Hot-plug fan" on page 40). 8. Remove the fan cage. To replace the component, reverse the removal steps. When re-installing the fans, press down on the top of each fan to be sure it is seated properly. Expansion slot covers CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage.
o To remove slot cover 1 or 4, push in on the retainer to release it, and then slide out the cover. o To remove slot covers 2 and 3, lift up on the latch, remove the latch, and then remove the cover.
o To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the cover.
6. Remove the cache module. To replace the component, reverse the removal procedure. CAUTION: To prevent damage to the cache module during installation, be sure the cache module is fully inserted before pressing down. Removing the battery pack To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31).
5. Disconnect the cable, and then remove the battery pack. To replace the component, reverse the removal procedure. Recovering data from the battery-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the BBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 30). 1. 2.
5. Power up the recovery server. A 1759 POST message is displayed, stating that valid data was flushed from the cache. This data is now stored on the drives in the recovery server. You can now transfer the drives (and controller, if one was used) to another server.
8. Open the ejector latches on each side of the cache module connector. Normally, the cache module is ejected from the cache module connector. If the module is not ejected automatically, remove the cache module. 9. If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the connector on the top of the cache module. To replace the component, reverse the removal procedure.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. 4. Extend the server from the rack (on page 27). 5. Remove the access panel ("Access panel" on page 31). 6. Remove the PCI riser cage ("PCI riser cage" on page 33). 7.
CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove the access panel ("Access panel" on page 31). 4.
o To remove slot covers 5 and 6, push down on the latch, rotate the latch down, and then remove the cover. Expansion boards Half-length expansion board To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. Disconnect any external cables that are connected to the expansion board. 5. Remove the PCI riser cage ("PCI riser cage" on page 33). 6.
7. Remove the expansion board. To replace the component, reverse the removal procedure. Full-length expansion board To remove the component: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. Disconnect any external cables that are connected to the expansion board. 5. Remove the PCI riser cage ("PCI riser cage" on page 33). 6. Disconnect any internal cables that are connected to the expansion board.
To replace the component, reverse the removal procedure. Heatsink To remove the heatsink: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 27). 3. Remove the access panel ("Access panel" on page 31). 4. If full-length expansion boards are installed, remove the PCI riser cage. 5. Remove the air baffle ("Air baffle" on page 32). 6. Open the heatsink retaining bracket. 7. Remove the heatsink.
To replace the heatsink: 1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 3. Install the heatsink.
4. Close and lock the heatsink retaining latches. 5. Install the air baffle ("Air baffle" on page 32). 6. If the PCI riser cage was removed, install the PCI riser cage. 7. Install the access panel ("Access panel" on page 31). 8. Install the server into the rack. 9. Power up the server. Power supply cage assembly To remove the component: 1. Power down the server (on page 26). 2. Access the product rear panel (on page 28). 3. Remove all power supplies ("Hot-plug power supply" on page 36). 4.
10. Remove the power supply cage assembly. To replace the component, reverse the removal procedure. Processor CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. IMPORTANT: Processor socket 1 must always be populated.
6. Open the heatsink retaining bracket. 7. Remove the heatsink.
8. Open the processor locking lever and the processor socket retaining bracket. 9. Using the processor tool, remove the processor from the system board: a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly. b. Press in on the plastic tabs, and then place the tool on the processor. c. Release the tabs, and then carefully lift the processor and tool straight up.
10. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket.
To replace the processor: 1. Carefully insert the processor into the processor installation tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area.
2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Never install or remove a processor without using the processor installation tool. • Do not touch the processor socket contacts.
3. Press and hold the tabs on the processor installation tool to separate it from the processor, and then remove the tool. 4. Close the processor socket retaining bracket and the processor locking lever. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 5.
6. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 7. Install the heatsink.
8. Close and lock the heatsink retaining latches. 9. Install the air baffle ("Air baffle" on page 32). 10. If the PCI riser cage was removed, install the PCI riser cage. 11. Install the access panel ("Access panel" on page 31). 12. Install the server into the rack. 13. Power up the server. DIMMs IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix these two types causes the server to halt during BIOS initialization.
5. Remove the DIMM. To replace the component, reverse the removal procedure. For DIMM configuration information, see the server user guide. Battery replacement If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
7. Remove the battery. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled. On = iLO 2 security is disabled. S2 Off Off = System configuration can be modified. On = System configuration is locked and cannot be modified.
System board To remove the component: 1. Power down the server (on page 26). 2. Extend or remove the server from the rack ("Remove the server from the rack" on page 28, "Extend the server from the rack" on page 27). 3. Remove all power supplies ("Hot-plug power supply" on page 36). 4. Remove the access panel ("Access panel" on page 31). 5. Remove the PCI riser cage ("PCI riser cage" on page 33). 6. Remove the battery pack ("Removing the battery pack" on page 51). 7.
14. Remove the heatsink. 15. Open the processor locking lever and the processor socket retaining bracket. 16. Using the processor tool, remove the processor from the system board: a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented correctly. b. Press in on the plastic tabs, and then place the tool on the processor.
c. 17. Release the tabs, and then carefully lift the processor and tool straight up. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. 18. Loosen the system board thumbscrew. 19. Remove the power supply cage.
20. Remove the system board. To replace the component: 1. Install the spare system board. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage.
2. Open the processor locking lever and the processor socket retaining bracket. Do not remove the processor socket cover. IMPORTANT: Be sure the processor remains inside the processor installation tool. 3. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area.
4. Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Never install or remove a processor without using the processor installation tool. • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket.
5. Press the tabs on the processor installation tool to separate it from the processor, and then remove the tool. 6. Close the processor socket retaining bracket and the processor locking lever. The processor socket cover is automatically ejected. Remove the cover. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance.
9. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 10. Install the heatsink. IMPORTANT: Install all components with the same configuration that was used on the failed system board. 11. Install all components removed from the failed system board. 12. Install the access panel ("Access panel" on page 31). 13. Install the power supplies ("Hot-plug power supply" on page 36). 14. Power up the server.
WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis. Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6.
Cabling SAS hard drive cabling Optical drive cabling Cabling 82
BBWC battery cabling FBWC capacitor pack cabling Cabling 83
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP. NOTE: The current version of SmartStart provides the memory spare part numbers for the server. To download the latest version, see the HP website (http://www.hp.com/support). Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM. Legacy USB support provides USB functionality in environments where USB support is not available normally.
Component identification Front panel components • SFF model Item Description 1 Quick release levers (2) 2 Systems Insight Display 3 Hard drive bays 4 SATA optical drive bay 5 Video connector 6 USB connectors (2) • SFF model with optional hard drive cage Item Description 1 Quick release levers (2) 2 Systems Insight Display 3 Hard drive bays 4 Hard drive bays (optional) 5 Video connector Component identification 87
Item Description 6 USB connectors (2) • LFF model Item Description 1 Quick release levers (2) 2 Systems Insight Display 3 Hard drive bays 4 USB connectors (2) 5 Video connector Front panel LEDs and buttons Item Description Status 1 UID LED and button Blue = Activated Flashing blue = System being remotely managed Off = Deactivated Component identification 88
Item Description Status 2 System health LED Green = Normal Amber = System degraded. Red = System critical. To identify components in degraded or critical state, see "Systems Insight Display LEDs (on page 89)." 3 Power On/Standby button and system power LED Green = System on Amber = System in standby, but power is still applied Off = Power cord not attached or power supply failure Systems Insight Display LEDs The HP Systems Insight Display LEDs represent the system board layout.
Item Description Status 1 NIC link/activity LED Green = Network link Flashing green = Network link and activity Off = No link to network. If the power is off, view the rear panel RJ-45 LEDs for status ("Rear panel LEDs and buttons" on page 92) 2 Power cap To determine Power cap status, see "Systems Insight Display LED combinations (on page 90).
Systems Insight Display Health LED LED and color Power supply (amber) Red System power LED Status Amber • • • Power supply (amber) Amber Green • • • • Power cap (off) — Amber Only one power supply is installed and that power supply is in standby. Power supply fault System board fault Redundant power supply is installed and only one power supply is functional. AC power cord is not plugged into redundant power supply.
10 Video connector 11 NIC 1 connector 12 NIC 2 connector 13 Mouse connector 14 Keyboard connector 15 Serial connector 16 iLO 3 connector 17 NIC 3 connector 18 NIC 4 connector Rear panel LEDs and buttons Item Description Status 1 Power supply LED Green = Normal Off = System is off or power supply has failed.
Secondary Primary (slot - form factor) PCIe2 riser (slot - form factor) slot description 4 - FL/FH 1 - FL/FH 5 - LP 6 - LP PCIe2 x16 riser slot description PCIe2/PCI-X riser slot description PCI-X 64 bit/133 MHz 2 - HL/FH PCIe2 x16 (8,4,1) PCIe2 x16 (16,8,4,1) PCIe2 x8 (4,1) — 3 - HL/FH PCIe2 x8 (4,1) PCIe2 x8 (4,1) — PCIe2 x16 (8,4,1) Notes: • "Primary" denotes the risers are installed in the primary riser connector.
System board System board components Item Description 1 Processor 2 DIMM slots 2 SAS power connector A 3 SAS power connector B 4 Front I/O connector 5 SATA optical drive connector 6 Internal USB connector 7 System battery 8 Power supply backplane connector 9 NMI jumper 10 System maintenance switch 11 Processor socket 2 12 Primary riser connector 13 SD card slot 14 TPM connector 15 Processor socket 1 (populated) Component identification 94
Item Description 16 Processor 1 DIMM slots 17 Secondary riser connector 18 SAS connector A 19 SAS connector B 20 Cache module connector 21 Fan connector 1 22 Fan connector 2 23 Fan connector 3 24 Fan connector 4 25 Fan connector 5 26 Fan connector 6 System maintenance switch Position Default Function S1 Off Off = iLO 3 security is enabled. On = iLO 3 security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.
DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single-rank 2R = Dual-rank 4R = Quad-rank 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.
SAS and SATA device numbers • SFF device bay numbering • Optional SFF device bay numbering • LFF device bay numbering Component identification 98
SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) SAS and SATA hard drive LED combinations Interpretation Online/activity LED (green) Fault/UID LED (amber/blue) On, off, or flashing Alternating amber and The drive has failed, or a predictive failure alert has been blue received for this drive; it also has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible. Off Off The drive is offline, a spare, or not configured as part of an array.
Battery pack LEDs Item ID Color Description 1 Green System Power LED. This LED glows steadily when the system is powered up and 12 V system power is available. This power supply is used to maintain the battery charge and provide supplementary power to the cache microcontroller. 2 Green Auxiliary Power LED. This LED glows steadily when 3.3V auxiliary voltage is detected.
LED3 pattern LED4 pattern Interpretation — One blink per second The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, stripe size migration, and RAID migration) are temporarily unavailable until charging is complete. The recharge process takes between 15 minutes and two hours, depending on the initial capacity of the battery.
Green LED Amber LED Interpretation Flashing (2 Hz) Alternating with amber LED Flashing (2 Hz) Alternating with green LED • • On On The flash code image failed to load. Off Off The flash code is corrupt. One of the following conditions exists: The charging process has timed out. The capacitor pack is not connected. Hot-plug fans CAUTION: To avoid damage to server components, fan blanks must be installed in fan bays 5 and 6 in a single-processor configuration.
• At POST and in the OS, iLO 3 performs an orderly shutdown if a cautionary temperature level is detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs, the server performs an immediate shutdown. • When the Thermal Shutdown feature is disabled in RBSU, iLO 3 does not perform an orderly shutdown when a cautionary temperature level is detected.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -30°C to 50°C (-22°F to 122°F) Storage -30°C to 60°C (-22°F to 140°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Rated input frequency 50 Hz to 60 Hz Rated input current 10 A at 100 VAC 4.
Rated steady-state power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input Maximum peak power 460 W at 100V to 120V AC input 460 W at 200V to 240V AC input Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/).
Acronyms and abbreviations ASR Automatic Server Recovery BBWC battery-backed write cache DDR double data rate FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log NMI non-maskable interrupt NVRAM non-volatile memory PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended POST Power-On Self Test RBSU ROM-Based Setup Utility Acronyms and abbreviations 108
SAS serial attached SCSI SATA serial ATA TPM trusted platform module UID unit identification USB universal serial bus Acronyms and abbreviations 109
Index expansion boards 56 expansion slot covers 48, 54 expansion slot covers, removing expansion slots 54 extending server from rack 27 A access panel 31 air baffle 32 B F battery 70, 94 battery cabling for BBWC 82 battery pack LEDs 99 battery-backed write cache (BBWC) 49, 51, 99 battery-backed write cache battery pack 49 BBWC cabling 82 bezel, front 45, 46 blue screen event 94 buttons 86 C cable management arm 28, 29 cables 81 cabling 81 cabling, BBWC 82 cache module 50 cache module, removing 50 cauti
LEDs, LEDs, LEDs, LEDs, battery pack 99 hard drive 97 SAS hard drive 97 troubleshooting 98 S safety considerations 30 SAS and SATA device numbers 96 SAS drive numbers 97 SAS hard drive LEDs 97 SD card slot 92 specifications 103 specifications, environmental 103 specifications, mechanical 103 specifications, power 103 specifications, server 105 static electricity 30 status lights, battery pack 99 switches 71, 94 system battery 70 system board 72, 92 system board components 92 system components 86 system ma
