User's Manual
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures
- Setup Utility
- Specifications
- Computer specifications
- 15.4-inch, WXGA, BrightView display specifications
- Hard drive specifications
- DVD±RW and CD-RW SuperMulti Double-Layer Combo Drive specifications
- HD DVD-ROM Drive with SuperMulti DVD±R/RW Double Layer support specifications
- Blu-ray Disc ROM Drive with SuperMulti DVD±R/RW Double-Layer (DL) support specifications
- System DMA specifications, Intel
- System DMA specifications, AMD
- System interrupt specifications, Intel
- System interrupt specifications, AMD
- System I/O address specifications, Intel
- System I/O address specifications, AMD
- System memory map specifications, Intel
- System memory map specifications, AMD
- Screw listing
- Phillips PM2.0×5.0 captive screw
- Phillips PM3.0×3.0 screw
- Phillips PM2.0×3.0 screw
- Phillips PM2.5×7.0 screw
- Phillips PM2.5×10.0 screw
- Phillips PM2.5×4.0 screw
- Phillips PM2.5×3.0 screw
- Hex HM5.0×9.0 standoff
- Phillips PM2.0×2.0 screw
- Phillips PM2.0×7.0 screw
- Phillips PM2.5×5.0 captive screw
- Phillips 2.5×4.0 captive screw
- Backup and recovery
- Connector pin assignments
- Power cord set requirements
- Recycling
- Index
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly (1) and (2), the processor (3), and the system board component (4) each time the fan/heat
sink assembly is removed. Thermal material must be installed on all surfaces before the fan/heat sink
assembly is reinstalled. Thermal material is included with all fan/heat sink assembly, system board, and
processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures 77