Specifications

9 March 1999 – Subject To Change Upgrading the AlphaPC 164LX 5–5
Increasing Microprocessor Speed
6. Install the heat sink and heat-sink fan as directed in the following steps. A heat-
sink/fan kit is available from the vendor listed in Appendix B. Refer to Figure 5–1
for heat-sink and fan assembly details.
Figure 5–1 Fan/Heat-Sink Assembly
a. Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to improve
the thermal conductivity between the chip package and the heat sink by replac-
ing micro air pockets with a less insulative material. Perform the following
steps to position the GRAFOIL pad:
1. Perform a visual inspection of the package slug to ensure that it is free of
contamination.
Guard, Fan
Alpha 21164
FM-06013.AI4
Heat Sink, with Fan
Mounting Holes
Nut, Hex, 1/4-20, 2011-T3
Aluminum, 0.438 in Across
Flats, Qty 2
Torque to 20 +/- 2 in-lbs
Clip, Heat Sink/Chip/Fan
Thermal Pad
Screw, 6-32 x 0.875 in
Qty 4
Fan
Airflow