Data Sheet

IDC7 Bluetooth Module
Model: IDC747
Page: 17 Copyright IOT747 Ref: IDC747-DTS-V003
IOT747, 122 Ross Street, Cambridge, CB1 3BU, United Kingdom
Check www.iot747.com for updates. Email: [e-mail] Back to TOC
IDC747 Module
Product Information Data Sheet
Ref: IDC747-DTS-V003
Latest Update: July 20, 2021
122 Ross Street, CB13BU
Cambridge, United Kingdom
www.iot747.com
Solder Reflow Profile
The solder profile is described below.
Zone A: Preheat: This raises the temperature at a controlled rate, typically 0.5 - 2C/s. This will preheat
the component to 120°C to 150°C to distribute the heat uniformly to the PCB.
Zone B: Equilibrium1: In this zone, the flux becomes soft and uniformly spreads solder particles over
the PCB board, preventing re-oxidisation. The recommended temperature for this zone is 150°C to
200°C for 60s to 120s.
Zone C: Equilibrium2: This is optional and in order to resolve the upright component issue.
Temperature is 210°C to 217°C for 20s to 30s.
Zone D: Reflow zone: The temperature should be high enough to avoid wetting but low enough to
avoid component deterioration. The recommended peak temperature is 230°C to 250°C. The
soldering time should be 30s to 90s when the temperature is above 217°C.
Zone E: Cooling: The cooling rate should be fast to keep the solder grains small which will give a
longer lasting joint. A typical cooling rate is 4°C/s.