User's Manual
COMPANY CONFIDENTIAL
Preliminary Datasheet
2
Index
1. REVISION HISTORY ................................................................................................................................................... 3
2. INTRODUCTION .......................................................................................................................................................... 4
2.1 HARDWARE ARCHITECTURE .................................................................................................................................... 4
2.2 FEATURES ................................................................................................................................................................ 5
2.3 STANDARDS COMPLIANCE ....................................................................................................................................... 5
3. MECHANICAL SPECIFICATION .............................................................................................................................. 6
3.1 MECHANICAL DRAWING ............................................................................................................................................ 6
3.2 PCB STACK .............................................................................................................................................................. 6
3.3 RECOMMENDED LGA LAND PATTERN ..................................................................................................................... 7
3.4 RECOMMENDED STENCIL APERTURE ....................................................................................................................... 7
3.5 RF CONNECTOR TYPE ............................................................................................................................................. 8
3.6 RF CABLE ASSEMBLY NOTICE .................................................................................................................................. 9
3.7 RF PORT DEFINE ...................................................................................................................................................... 9
4. LGA PIN-OUT DEFINITION ..................................................................................................................................... 10
4.1 MODULE PIN-OUT DEFINITION ................................................................................................................................. 10
4.2 PIN DEFINITION ....................................................................................................................................................... 11
5. PRODUCT SPECIFICATION ................................................................................................................................... 13
5.1 DC ELECTRICAL SPECIFICATION ........................................................................................................................... 13
5.2 RF CHARACTERISTICS(TBD) ................................................................................................................................. 13
5.3 POWER UP SEQUENCE AND TIMING ...................................................................................................................... 15
5.3.1 Control signal Timing (WLAN=ON, BT=ON) ........................................................................................... 16
5.3.2 Control signal Timing (WLAN=OFF, BT=OFF) ....................................................................................... 16
5.3.3 Control signal Timing (WLAN=ON, BT=OFF) ......................................................................................... 17
5.3.3 Control signal Timing (WLAN=OFF, BT=ON) ......................................................................................... 17
5.3.4 WLAN Boot Up Sequence .......................................................................................................................... 17
5.4 UART HOST INTERFACE TIMING ........................................................................................................................... 18
5.5 PCM INTERFACE TIMING ....................................................................................................................................... 19
6.SCHEMATIC REFERENCE DESIGN ...................................................................................................................... 24
7. SOFTWARE REQUIREMENT(TBD) ....................................................................................................................... 26
8. REGULATORY(TBD) ................................................................................................................................................ 26
9. QUALITY ..................................................................................................................................................................... 26
10. PACKAGE INFORMATION ................................................................................................................................... 27
11. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ..................................................................... 28
11.1 TEMPERATURE ..................................................................................................................................................... 28
11.2 PCB BENDING ...................................................................................................................................................... 28
11.3 HANDLING ENVIRONMENT .................................................................................................................................... 28
11.4 STORAGE CONDITION .......................................................................................................................................... 28
11.5 BAKING CONDITION .............................................................................................................................................. 28
11.6 SOLDERING AND REFLOW CONDITION .................................................................................................................. 29