Parts List

Transmitter Main Board Instruction Manual 3-1
3 TRANSMITTER ALIGNMENT
3.1 General
Transmitter alignment is simplified by using an M-3 Subrack, SM-3 System Monitor, and RF
extender cable to provide transmitter power and signal interconnection. Alternatively, +9.5 Vdc and
+13.8 Vdc may be applied directly to a transmitter module through positive connection for the
+9.5 Vdc to pins B6 and Z6, for the +13.8 Vdc to pins B2 and Z2, and negative connection to pins
B30, Z30, B32, and Z32. Transmitter balanced audio (600 Ω) is available at pins B18 and Z18.
3.2 Repair Note
MT-3 Transmitter modules are mainly made up of surface mount devices which should not be
removed or replaced using an ordinary soldering iron. Removal and replacement of surface mount
components should be performed only with specifically designed surface mount rework and repair
stations complete with ElectroStatic Dissipative (ESD) protection.
When removing Surface Mount Solder Jumpers, it is recommended to use solder braid in place of
manual vacuum type desoldering tools when removing jumpers. This will help prevent damage to
the circuitboards.
3.3 Printed Circuitboard Numbering Convention
To ease troubleshooting and maintenance procedures, Daniels Electronics Limited has adopted a
printed circuitboard (PCB) numbering convention in which the last two digits of the circuitboard
number represent the circuitboard version. For example:
• PCB number 43-912010 indica tes circuitboard version 1.0;
• PCB number 50002-02 indicates circuitboard version 2.0.
All PCB's manufactured by Daniels Electronics are identified by one of the above conventions.
3.4 Recommended Test Equipment List
Alignment of the complete transmitter requires the following test equipment or its equivalent. It is
assumed that any adjustment of the Transmitter Main Board will also involve the other modules.
Dual Power Supply: Regulated +9.5 Vdc at 2 A.
Regulated +13.8 Vdc at 2 A - Topward TPS-4000
Oscilloscope / Multimeter: Fluke 97 Scopemeter
Current Meter: Fluke 75 multimeter