User manual

OG3-FR User Manual (V1.0) 2-13
Ventilation and Cooling
Your frame was specially engineered to minimize internal heat buildup and thus improve card
reliability. For information on the power dissipation of openGear cards, refer to the user manual for
your card.
Overview
For applications using less than 40W in a non-ventilated openGear frame, but where the individual card
power consumption is greater than 8W, the cards should be evenly distributed in the frame. This will
prevent the creation of concentrated heat, or unbalanced heat-rise areas, in the frame.
Notice — For reliable performance, it is recommended that the frame door not be
opened for longer than 5 minutes on frames loaded with more than 40W.
OG3-FR Series Frames
The OG3-FR series frames come standard with a Cooling Fan Module installed in the frame door. The
frame and PS-OG3 can supply up to a maximum of 300W of card power, with 15W per card. Under
these ventilated conditions, there is no requirement for extra vertical spacing between the frames. The
OG3-FR series frames can be stacked one on top of the other, a feature that is highly desirable in
densely crowded rack frame environments.
Notice — The two sides of the OG3-FR series frame have perforations that are
needed to ventilate the power supplies and must not be blocked.