Specifications

Specifications
6-4 ◆ Section 6: Specifications and Parts DS2000 Hardware Manual
Mechanical Specifications
Equipment Width Depth Height Weight
4 Slot KSU:
8 Slot KSU
10 3/4”
19 1/2”
5 7/8”
5 7/8”
13 11/16”
13 11/16”
4 lbs 5 oz
6 lbs 12 oz
Non-display Keyset: 7 1/4” 9” 2 7/8” 1 1b 11 oz
Display Keyset: 7 1/4” 9” 2 7/8” 1 lb 12 oz
Super Display Keyset: 7 1/4” 9” 2 7/8” 2 lb
24-Button DSS Console 2 1/2” 9” 2 3/4” 9 oz
110-Button DSS Console: 7 7/8” 8 3/4” 2 3/4” 1 lb 6 oz
2-OPX Module: 9 3/8” 7 3/8” 1 1/4” 3 lbs
CPU Relay Contacts
Contact Configuration: Normally open
Maximum Load: 60 mA @ 30 VDC
10 mA @ 90 VDC
Maximum Initial Contact Resistance: 50 mOhms
BGM/MOH Music Source Input
Music input is located on the CPU PCB.
Input Impedance: 10K Ohms
Input Level: +18 dBr (+ 2 dBr) @ 1.0 Khz
REJ Recording Jack Output Specifications
Output Impedance: 200 Ohms
Output Level (into 10K Ohm load): Keyset volume setting 1 = -7.8 dBr
Keyset volume setting 7 = -5.3 dBr
The REJ broadcasts both sides of the keyset conversation (i.e., the user’s voice and the caller’s
voice) whenever the user lifts the handset. The REJ does not broadcast paging announcements or
activate for Handsfree calls.