Specifications

Index 3
TRIP 252
V.35 50, 257
X.21 50
console
cable 84
terminal 153
console port 107, 250
baud rate 172
description 31
pinouts 250
settings 178
conventions
See document conventions
cooling subsystem 152
copy command 146
copying to Flash 179
CPU
FSIP 46
system 153
CPU Halt LED on RP
See LEDs
CRC
configuring 207
description of 105
crc32 command 208
Critical status level, environmental monitor 62
CSU 85
current rating, chassis 20
CxBus 17
arbitration 21
Cyclic Redundancy Check
see CRC
D
damage from overheating 61
danger, warning
description xv
DAS
description 99
DB-9 connector 44
DC Fail LED on power supply
See LEDs
DC power 62
and environmental monitor 62
voltages 151
DCE
clock signals 206
devices 137
debug commands 172
dimensions
chassis 20
interface processors 38
DIN connector 253
displays, environmental 63
document conventions xv
downloadable microcode 165
downloadable microcode, description of 58
DRAM 28
DSU 85, 137
DTE
devices 137
dual attachment stations
See DAS
dual homing
description 101
dual ring
description 99
dual-attached station 45, 273
dust 237
E
E1-G.703/G.704
cables 104
early token release 96
early token release command 97
EIA 310C 21
EIP
description of 41
LEDs 271
microcode ROM replacement 166
port signals 250
speed 38
ejector levers 156
description 20
electromagnetic pulse (EMP), avoiding 72
electrostatic discharge 71
EMI filter clip, AIP 126
enable command 181
Enabled LED on interface processors 39
enabled LED on interface processors 152
See LEDs
environmental monitor description 61
EPROM 28
error correction, CRC 106
ESD prevention 71
Ethernet 73
AUI connector pinouts 250
AUI port signals 250
cables 250
connector locks 92
ports on EIP 42
transceiver 42, 85, 91, 163
Ethernet interface processor
See EIP
example of port addresses 55
examples